EA-OEM-306 Embedded Artists, EA-OEM-306 Datasheet - Page 66

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EA-OEM-306

Manufacturer Part Number
EA-OEM-306
Description
KIT LPC3152 SODIMM 66X48 200POS
Manufacturer
Embedded Artists
Type
MCUr
Datasheet

Specifications of EA-OEM-306

Contents
Base Board, Cable, Headset, OEM Board, Serial Number
For Use With/related Products
LPC3152
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
Table 25.
T
[1]
[2]
[3]
[4]
[5]
[6]
LPC3152_3154
Preliminary data sheet
Symbol Parameter
t
t
t
t
t
t
t
t
h(o)
d(AV)
h(A)
d(QV)
h(Q)
su(D)
h(D)
QZ
amb
Parameters are valid over operating temperature range unless otherwise specified.
All values valid for pads set to high slew rate. VDDE_IOA = VDDE_IOB = 1.8 ± 0.15 V. VDDI = 1.2 ± 0.1 V.
Refer to the LPC3152/3154 user manual for the programming of MPMCDynamicReadConfig and SYSCREG_MPMP_DELAYMODES
registers.
f
t
SYSCREG_MPMP_DELAYMODES register bits 11:6.
t
oper
d(o)
su(D)
=
, t
40
= 1 / T
, t
h(o)
h(D)
address valid delay
time
address hold time
data output valid
delay time
data output hold time
data input set-up
time
data input hold time
data output
high-impedance time
°
output hold time
Dynamic characteristics of SDR SDRAM memory interface
, t
C to +85
d(AV)
times are dependent on SYSCREG_MPMP_DELAYMODES register bits 5:0.
CLCL
, t
h(A)
°
, t
C, unless otherwise specified.
d(QV)
, t
h(Q)
times are dependent on MPMCDynamicReadConfig register value and
Conditions
on pin EBI_CKE
on pins
EBI_NRAS_BLOUT,
EBI_NCAS_BLOUT,
EBI_NWE,
EBI_NDYCS
on pins EBI_DQM_1,
EBI_DQM_0_NOE
All information provided in this document is subject to legal disclaimers.
Rev. 0.12 — 27 May 2010
[1][2][3]
[5]
[5]
[5]
[5]
[5]
[6]
[6]
0.13
−0.1
1.7
-
−0.1
-
4
<tbd>
<tbd>
-
Min
-
-
-
-
-
-
-
-
-
-
…continued
Typical
LPC3152/3154
3.6
3.6
5
5
5
9
10
-
-
<T
CLCL
© NXP B.V. 2010. All rights reserved.
Max
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Unit
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