ST7MDTU2-EMU2B STMicroelectronics, ST7MDTU2-EMU2B Datasheet - Page 69

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ST7MDTU2-EMU2B

Manufacturer Part Number
ST7MDTU2-EMU2B
Description
KIT EMULATOR FOR ST7262X/7261X
Manufacturer
STMicroelectronics
Series
ST7-EMU2Br
Type
Microcontrollerr
Datasheets

Specifications of ST7MDTU2-EMU2B

Contents
Main Emulation Board (MEB), Target Emulation Board (TEB), Cables, Power Supply and Documentation
For Use With/related Products
ST7262x, ST7621x
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
497-4881
ST7MDTU2-EMU2B User Manual
APPENDIX C:GLOSSARY
Application Board
This is the printed circuit board onto which you wish to connect the target ST7
MCU. It should include a socket or footprint so that you can connect the application
board to your emulator or development kit using the probe and the appropriate
device adapter. This allows you to emulate the behavior of the ST7 MCU in a real
application in order to debug your application program.
Bug-Catcher
This is a special device adapter with easily accessible signal pins, so that you can
link each of the pins to an external measuring device (such as a multimeter or an
oscilloscope). You use the bug-catcher like any other device adapter—it connects
to the Active Probe and to your application board—but you have more control over
each individual pin signal.
Device Adapter
Device adapters are included in your emulator kit to allow you to connect the
emulator to your application board. The type of device adapter depends on the
target device’s packaging. Many MCUs come in more than one different package,
and you should therefore use the device adapter that corresponds to the type of
package you have chosen for your application.
DIL
Dual In Line. Designates a type of device package with two rows of pins for thru-
hole mounting. Sometimes also called DIP (Dual In-line Package).
ECP
Extended capabilities port communication standard.
EPP
Enhanced parallel port communication standard.
Footprint
Designates the dimensions of the location of a component on a printed circuit
board or in a socket. It depends on the number of pins, their size, type and
positioning. The footprint of each ST7 device is specified in the datasheet in the
section titled Package Mechanical Data.
Appendix C: Glossary
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