AD8019AR-EVAL Analog Devices Inc, AD8019AR-EVAL Datasheet - Page 4

• Manufacturer Part Number: AD8019AR-EVAL
• Description: BOARD EVAL FOR AD8019 SOIC
• Manufacturer: Analog Devices Inc
• Type: Drivers, Receivers, Transceiversr

Specifications of AD8019AR-EVAL

• Rohs Status: RoHS non-compliant
• Contents: Evaluation Board
• For Use With/related Products: AD8019 SOP

AD8019
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.4 V
Internal Power Dissipation
Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . .
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit Duration
Storage Temperature Range . . . . . . . . . . . . –65 C to +125 C
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 C
NOTES
1
2
3
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8019 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device on a four-layer board with 10 inches
Specification is for device on a four-layer board with 10 inches
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
85 C 14-lead TSSOP package:
85 C 8-lead SOIC package:
TSSOP-14 Package
SOIC-8 Package
. . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
3
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 W
Model
AD8019ARU
AD8019ARU-Reel
AD8019ARU-EVAL
AD8019AR
AD8019AR-Reel
AD8019AR-EVAL
JA
. . . . . . . . . . . . . . . . . . . . . . . . . 2.2 W
= 100 C/W.
JA
= 90 C/W.
1
2
2
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
of 1 oz. copper at
of 1 oz. copper at
ORDERING GUIDE
V
V
S
S
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8019
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for a plastic encapsulated
device is determined by the glass transition temperature of the
plastic, approximately 150 C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
The output stage of the AD8019 is designed for maximum load
current capability. As a result, shorting the output to common
can cause the AD8019 to source or sink 500 mA. To ensure
proper operation, it is necessary to observe the maximum power
derating curves. Direct connection of the output to either power
supply rail can destroy the device.
Package
Description
14-Lead TSSOP
14-Lead TSSOP
Evaluation Board
8-Lead SOIC
8-Lead SOIC
Evaluation Board
2.5
2.0
1.5
1.0
0.5
0
–40 –30 –20 –10
AMBIENT TEMPERATURE – C
0
TSSOP
10
SOIC
Package
Option
RU-14
RU-14 Reel
ARU-EVAL
R-8
R-8 Reel
AR EVAL
20
WARNING!
30
40
50
ESD SENSITIVE DEVICE
60
70
80