AD8337-EVAL-INV Analog Devices Inc, AD8337-EVAL-INV Datasheet - Page 25

• Manufacturer Part Number: AD8337-EVAL-INV
• Description: KIT EVAL DUAL SUPPLY INV AD8337
• Manufacturer: Analog Devices Inc
• Series: X-AMP®r

Specifications of AD8337-EVAL-INV

• Channels Per Ic: 1 - Single
• Amplifier Type: Voltage Feedback
• Output Type: Single-Ended
• Slew Rate: 625 V/µs
• -3db Bandwidth: 280MHz
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (main Ic): 18.5mA
• Voltage - Supply, Single/dual (±): ±2.5 V ~ 5 V
• Board Type: Fully Populated
• Utilized Ic / Part: AD8337
• Lead Free Status / RoHS Status: Not applicable / Not applicable

MEASUREMENT SETUP
Figure 83 shows board connections for two generators. In this
example, the experiment illustrates IMD measurements using
standard off-the-shelf test equipment used by Analog Devices.
However, any equivalent equipment can be used.
BOARD LAYOUT CONSIDERATIONS
The AD8337 evaluation board is designed using four layers.
Interconnecting circuitry is located on the component and
wiring sides, with the inner layers dedicated to power and
ground planes. Figure 84 through Figure 88 show the copper
layouts.
TOP:
SIGNAL GENERATOR 10.05MHz, 500mV p-p
BOTTOM:
SIGNAL GENERATOR 9.95MHz, 500mV p-p
SIGNAL
INPUT
PREAMP
OUTPUT
Figure 83. Typical Board Test Connections
AMPLIFIERS
POWER
Rev. C | Page 25 of 32
POWER SUPPLY
–5V
For ease of assembly, all board components are located on the
primary side and are 0603 size surface mounts. Higher density
applications may require components on both sides of the board
and present no problem to the AD8337, as demonstrated in
unreleased versions of the board that featured secondary-side
components and vias. Not evident in the figures are thermal
vias within the pad that solder to the mating pad of the AD8337
chip-scale package. These vias serve as a thermal path and are
the primary means of removing heat from the device. The thermal
specifications for the AD8337 are predicated on the use of multi-
layer board construction with these thermal vias to enable heat
conductivity from the die.
SPLITTER
POWER
+5V
VGAIN
SPECTRUM
ANALYZER
AD8337