ADP2503-4.5-EVALZ Analog Devices Inc, ADP2503-4.5-EVALZ Datasheet - Page 4

• Manufacturer Part Number: ADP2503-4.5-EVALZ
• Description: BOARD EVALUATION ADP2503 4.5V
• Manufacturer: Analog Devices Inc

Specifications of ADP2503-4.5-EVALZ

• Main Purpose: DC/DC, Step Up or Down
• Outputs And Type: 1, Non-Isolated
• Power - Output: 2.7W
• Voltage - Output: 4.5V
• Current - Output: 600mA
• Voltage - Input: 2.5 ~ 5.5V
• Regulator Topology: Buck-Boost
• Frequency - Switching: 2.5MHz
• Board Type: Fully Populated
• Utilized Ic / Part: ADP2503
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADP2503/ADP2504
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
PVIN, VIN, SW1, SW2, VOUT, SYNC,
PGND to AGND
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Lead Temperature
ESD Human Body Model
ESD Charged Device Model
ESD Machine Model
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages
are referenced to GND.
EN, FB
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
−0.3 V to +6 V
−0.3 V to 0.3 V
−40°C to +85°C
−40°C to +125°C
−65°C to +150°C
300°C
215°C
220°C
±2000 V
±1500 V
±100 V
Rev. 0 | Page 4 of 16
THERMAL RESISTANCE
θ
PCB. For a typical printed circuit board of a handset, the total
thermal resistance is higher. For correct operation up to 85°C
ambient temperature the total thermal resistance must not
exceed 100 K/W.
Table 3.
Package Type
10-Lead LFCSP (QFN)
ESD CAUTION
JA
is specified for a device soldered to a standard JEDEC2S2P
θ
84
JA
Unit
°C/W