PR39MF51NSZF Sharp Microelectronics, PR39MF51NSZF Datasheet
PR39MF51NSZF
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PR39MF51NSZF Summary of contents
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... PPR39MF51NSZ Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 4.0kV isolation (V (rms) ) from input to output. iso ■ ...
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... Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. PR39MF51NSZF] –0.3 1.2 –0.2 1.05 SHARP Model No mark "S" Rank mark Date code (2 digit) Anode mark Factory identification mark –0.5 9.66 –0.25 2.54 –0.1 0.5 Product mass : approx. 0.56g Cathode Gate Anode 6 Output (T ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol I Forward current F Input V Reverse voltage R I (rms) RMS ON-state current T Output I Peak one cycle surge current surge V Repetitive peak OFF-state voltage DRM *1 V (rms) Isolation voltage ...
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... Model Line-up (1) (Lead-free terminal components) Lead Form Through-Hole Sleeve Shipping Package 50pcs/sleeve Model No. PR39MF51NSZF ■ Model Line-up (2) (Lead solder plating components) Lead Form Through-Hole Sleeve Shipping Package 50pcs/sleeve Model No. PR39MF51NSZ Please contact a local SHARP sales representative to see the actual status of the production. ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Forward Current vs. Forward Voltage 25˚C 0˚C 100 T =75˚ −25˚C 50˚ 0.5 ...
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Fig.7 ON-state Current vs. ON-state Voltage 1.2 I =20mA F T =25˚C a 1.0 0.8 0.6 0.4 0 0.2 0.4 0.6 0.8 ON-state voltage V Remarks : Please be aware that all data in the graph are just ...
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Design Considerations ● Recommended Operating Conditions Parameter Input signal current at ON state Input Input signal current at OFF state Load supply voltage Output Load supply current Frequency Operating temperature ∗ See Fig.2 about derating curve (I ...
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Recommended Foot Print (reference) ● Standard Circuit Tr1 ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. SMT Gullwing Lead-form 8.2 2.2 (Unit : mm) Load 2 8 ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
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Package specification ● Sleeve package Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...
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Tape and Reel package SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...