S101S16F Sharp Microelectronics, S101S16F Datasheet
S101S16F
Specifications of S101S16F
Related parts for S101S16F
S101S16F Summary of contents
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... S101S16V Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 3.0kV isolation (V (rms) ) from input to output. iso ■ ...
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Internal Connection Diagram Zero Crossing Circuit ■ Outline Dimensions S101S16V ±0.2 18.5 ±0.3 16.4 ±0.2 φ3.2 Common to pin No.1 Common to pin No.1 CSA mark Epoxy resin S101S16V UL mark Model No. ∗ Date ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Peak one cycle surge current Repetitive peak OFF-state voltage Output Non-Repetitive peak OFF-state voltage Critical rate of rise of ON-state current Operating frequency *1 Isolation voltage Operating ...
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... Model Line-up (1) (Lead-free terminal components) Case Shipping Package 200pcs/case Model No. S101S16F ■ Model Line-up (2) (Lead solder plating components) Case Shipping Package 200pcs/case Model No. S101S16V Please contact a local SHARP sales representative to see the actual status of the production. I [mA DRM (V =6V, D [V] R =30Ω ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.2 RMS ON-state Current vs. Ambient Temperature ( − Ambient temperature ...
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Fig.5 Surge Current vs. Power-on Cycle Power-on cycle (Times) Fig.7 Minimum Trigger Current vs. Ambient Temperature − Ambient temperature T Remarks ...
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Design Considerations ● Recommended Operating Conditions Parameter Input signal current at ON state Input Input signal current at OFF state Load supply voltage Output Load supply current Frequency Operating temperature ∗ See Fig.2 about derating curve (I ...
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In case the optional heat sink is screwed up, please solder after screwed. In case of the lead frame bending, please keep the following minimum distance and avoid any mechanical stress between the base of terminals and the molding resin. ...
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Manufacturing Guidelines ● Soldering Method Flow Soldering (No solder bathing) Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please solder within one time. Other ...
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Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
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Package specification Package materials Packing case : Corrugated cardboard Partition : Corrugated cardboard Pad : Corrugated cardboard Cushioning material : Polyethylene Molt plane : Urethane Package method The product should be located after the packing case is partitioned and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...