TLA-6T119LF TDK Corporation, TLA-6T119LF Datasheet - Page 34
![XFRMR FOR QS6611 CHIP SET 16SOP](/photos/10/14/101406/16-sop_pkg_sml.jpg)
TLA-6T119LF
Manufacturer Part Number
TLA-6T119LF
Description
XFRMR FOR QS6611 CHIP SET 16SOP
Manufacturer
TDK Corporation
Series
TLAr
Datasheet
1.TLA-6T211A.pdf
(38 pages)
Specifications of TLA-6T119LF
Operating Temperature Range
0 C to + 70 C
Termination Style
PC Terminals
Dimensions
11.6 mm L x 9.2 mm W x 5.9 mm H
Product
Pulse Transformers
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
-
Inductance
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
PACKAGING STYLES
Tray : 400pieces/box
RECOMMENDED SOLDERING CONDITION
FLOW SOLDERING
Preheating: 90 to 130°C for 30 to 45 seconds.
Soldering: 255°C max. 5±1 seconds
• Perform flow soldering from the underside of the board.
• The surface of plastic protrusions inserted into the board may
• The cutted end of terminal has no plating(out of subject of solder
RECOMMENDED CONDITION FOR LONG TERM STORE
When it stores for a long term, please avoid place of high tempera-
ture and high humidity. Recommend that it uses after the delivery
within 1year.
Temperature range: +5 to +30°C
Humidity: 60(%)RH max.
• All specifications are subject to change without notice.
255˚C max.
130˚C
90˚C
melt, but this causes no problems with regard to electrical
properties or mounting.
ability).
Preheating: 30 to 45s
Time ( s )
5±1s
Natural
cooling
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