A700V826M2R5ATE028 Kemet, A700V826M2R5ATE028 Datasheet - Page 11
![CAP AO TYPE 82UF 2.5V 20% SMD](/photos/10/27/102764/a700_series_case_size_v_sml.jpg)
A700V826M2R5ATE028
Manufacturer Part Number
A700V826M2R5ATE028
Description
CAP AO TYPE 82UF 2.5V 20% SMD
Manufacturer
Kemet
Series
AO-Cap A700r
Specifications of A700V826M2R5ATE028
Capacitance
82µF
Voltage Rating
2.5V
Tolerance
±20%
Operating Temperature
-55°C ~ 125°C
Features
Polymer
Ripple Current
3.1A
Esr (equivalent Series Resistance)
28.0 mOhm
Mounting Type
Surface Mount
Package / Case
2917 (7343 Metric)
Size / Dimension
0.287" L x 0.169" W (7.30mm x 4.30mm)
Height
0.075" (1.90mm)
Surface Mount Land Size
0.287" L x 0.169" W (7.30mm x 4.30mm)
Esr
28 mOhms
Operating Temperature Range
- 55 C to + 125 C
Termination Style
SMD/SMT
Dimensions
4.3 mm W x 7.3 mm L x 1.9 mm H
Dissipation Factor Df
6
Leakage Current
12.3 uAmps
Product
Organic Polymer Aluminum - Chip Capacitors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Lifetime @ Temp.
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-3041-2
A700V826M004AT6003
A700V826M004AT6003
KEMET Aluminum Organic Capacitor (AO-CAP) – A700 Series Polymer Aluminum
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions. Note that although the
X/7343-43 case size can withstand wave soldering, the tall profile
(4.3mm maximum) dictates care in wave process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Time 25°C to peak temperature
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
temperature (t
Preheat/Soak
s
) from T
smin
L
to t
to t
P
P
)
to t
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
)
Sn-Pb Assembly
6 minutes max
3°C/sec max
6°C/sec max
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
T
T
25
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2020-1 • 4/13/2011
t
L
t
P
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