T498B336K006ATE1K7 Kemet, T498B336K006ATE1K7 Datasheet - Page 9
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T498B336K006ATE1K7
Manufacturer Part Number
T498B336K006ATE1K7
Description
CAP TANT 33UF 6.3V 10% SMD
Manufacturer
Kemet
Series
T498r
Type
Moldedr
Specifications of T498B336K006ATE1K7
Capacitance
33µF
Voltage - Rated
6.3V
Tolerance
±10%
Esr (equivalent Series Resistance)
1.700 Ohm
Operating Temperature
-55°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
1210 (3528 Metric)
Size / Dimension
0.138" L x 0.110" W (3.50mm x 2.80mm)
Height
0.075" (1.90mm)
Manufacturer Size Code
B
Features
General Purpose
Voltage Rating
6.3 Volts
Esr
1.7 Ohms
Operating Temperature Range
0 C to + 150 C
Mfr Case Code
B Case
Dimensions
2.8 mm W x 3.5 mm L x 1.9 mm H
Lead Spacing
0.5 mm
Product
Tantalum Solid High Temperature
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-4753-2
High Temperature MnO
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Time 25°C to peak temperature
Silver Paint
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
Leadframe
(-Cathode)
temperature (t
Preheat/Soak
s
) from T
smin
MNO
L
to T
to T
P
P
)
to T
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
2
)
2
Tantalum Surface Mount Capacitors – T498 150°C Rated MnO
Carbon
/Ta
2
Sn-Pb Assembly
O
5
/Ta
6 minutes max
3°C/sec max
6°C/sec max
Tantalum Wire
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
Silver Adhesive
Weld
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
Washer
Leadframe
(+Anode)
2
Series
T
T
25
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2012-1 • 1/17/2011
t
L
t
P
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