C1608X5R0J475K TDK Corporation, C1608X5R0J475K Datasheet - Page 59

CAP CER 4.7UF 6.3V X5R 0603

C1608X5R0J475K

Manufacturer Part Number
C1608X5R0J475K
Description
CAP CER 4.7UF 6.3V X5R 0603
Manufacturer
TDK Corporation
Series
Cr
Datasheets

Specifications of C1608X5R0J475K

Capacitance
4.7µF
Package / Case
0603 (1608 Metric)
Voltage - Rated
6.3V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Features
Low ESR
Applications
General Purpose
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Thickness
0.80mm
Tolerance (+ Or -)
10%
Voltage
6.3VDC
Temp Coeff (dielectric)
X5R
Operating Temp Range
-55C to 85C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
1.6mm
Product Depth (mm)
0.8mm
Product Height (mm)
0.8mm
Product Diameter (mm)
Not Requiredmm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
445-5178-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C1608X5R0J475KT000N
Manufacturer:
TDK
Quantity:
9 203
• All specifications are subject to change without notice. Please read the precautions before using the product.
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
General
Specifications
Applied for C0603, C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 1a
Appendix - 2a
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
c
C Series — General Application
C0603
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
c
US Catalog // C Series — General Application // Version A11
Solder Resist
100 mm
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c

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