C1632X7R1E224K TDK Corporation, C1632X7R1E224K Datasheet - Page 12

CAP CER .22UF 25V 10% X7R 0612

C1632X7R1E224K

Manufacturer Part Number
C1632X7R1E224K
Description
CAP CER .22UF 25V 10% X7R 0612
Manufacturer
TDK Corporation
Series
Cr
Datasheets

Specifications of C1632X7R1E224K

Capacitance
0.22µF
Tolerance
±10%
Package / Case
1206 (3216 Metric) Wide, 0612 (1632 Metric)
Voltage - Rated
25V
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESL
Applications
General Purpose
Size / Dimension
0.063" L x 0.126" W (1.60mm x 3.20mm)
Thickness
0.70mm
Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
Low ESR MLCCs
Dimensions
3.200 mm W x 1.600 mm L x 0.700 mm H
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-1815-2
C1632X7R1E224KT
• All specifications are subject to change without notice. Please read the precautions before using the product.
US Catalog // C Series — Flipped Type // Version A11
Material : Glass Epoxy ( As per JIS C6484 GE4 )
P.C. Board thickness : Appendix 1,2
General
Specifications
Copper ( thickness 0.035mm )
Solder resist
c
Solder Resist
P.C. Board for reliability test
Appendix - 1
100 mm
Copper
1.6mm
C Series — Low ESL Flipped Type
C0510
C0816
C1220
C1632
JIS
Case Code
Solder Resist
CC0204
CC0306
CC0508
CC0612
EIA
P.C. Board for bending test
Appendix - 2
100 mm
b
0.75
0.2
0.3
0.5
a
a
Dimensions (mm)
Copper
0.6
1.0
1.6
2.2
b
1.0
1.6
2.0
3.2
c

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