CLLE1AX7S0G225M/0.95 TDK Corporation, CLLE1AX7S0G225M/0.95 Datasheet - Page 11

• Manufacturer Part Number: CLLE1AX7S0G225M/0.95
• Description: CAP LOW ESL 2.2UF 4V X7S 0805
• Manufacturer: TDK Corporation
• Series: CLLr

Specifications of CLLE1AX7S0G225M/0.95

• Capacitance: 2.2µF
• Voltage - Rated: 4V
• Tolerance: ±20%
• Temperature Coefficient: X7S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESL, Multi-Terminal
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.95mm Max
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-3406-2

Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
B
A
B
C
D
P
Type
Soldering
Information
A
(C1608/CC0603)
CLLC1A
0.25
0.4
1.2
0.4
0.4
CLL Series — Ultra Low Inductance Capacitors
P
Minimum amount
Maximum amount
(C2012/CC0805)
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
CLLE1A
0.3 ~ 0.6
1.3 ~ 1.8
0.5 ~ 0.8
D C
0.3
0.5
Unit: mm
Peak
Temp
US Catalog // CLL Series — Ultra Low Inductance Capacitors // Version A11
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Reflow Soldering
Temp./
Peak Temp time
Dura.
Soldering Natural
cooling
Peak temp
230 max.
260 max.
(°C)
Reflow Soldering
Temp. (ºC)
300
∆T ≤ 150
∆T ≤ 150
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)