LG226C103MAT2S1 AVX Corporation, LG226C103MAT2S1 Datasheet - Page 3

• Manufacturer Part Number: LG226C103MAT2S1
• Description: CAP CER 10000PF 6.3V 0306 LOWIND
• Manufacturer: AVX Corporation
• Series: LG22 (LGA)r

Specifications of LG226C103MAT2S1

• Capacitance: 10000pF
• Tolerance: ±20%
• Package / Case: 0603 (1608 Metric) Wide, 0306 (0816 Metric)
• Voltage - Rated: 6.3V
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -50°C ~ 125°C
• Features: Low ESL
• Applications: General Purpose
• Size / Dimension: 0.030" L x 0.063" W (0.76mm x 1.60mm)
• Thickness: 0.55mm Max
• Voltage Rating: 6.3 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: X7R
• Product: Low Inductance MLCCs
• Dimensions: 1.60 mm W x 0.76 mm L x 0.55 mm H
• Dissipation Factor Df: 6.5
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 478-4627-2

LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Arrays
APPLICATIONS
Semiconductor Packages
• Microprocessors/CPUs
• Graphics Processors/GPUs
• Chipsets
• FPGAs
• ASICs
0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC
0.001
0.01
0.1
1
1
10
Frequency (MHz)
Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.
These new LGA products are the third low inductance family developed by AVX. The in-
novative LGA technology sets a new standard for low inductance MLCC performance.
Electronic Products awarded its 2006 Product of the Year Award to the LGA Decoupling
capacitor.
Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal
IDC low inductance MLCC with a number of advantages including:
• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs
• Opportunity to reduce PCB or substrate contribution to system ESL by using multi-
• Advanced FCT manufacturing process used to create uniformly flat terminations on
• Better solder joint reliability
ple parallel vias in solder pads
the capacitor that resist “tombstoning”
Board Level Device Decoupling
• Frequencies of 300 MHz or more
• ICs drawing 15W or more
• Low voltages
• High speed buses
100
1000
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