C0805C102KBRACTU Kemet, C0805C102KBRACTU Datasheet - Page 2

CAP CER 1000PF 630V X7R 0805

C0805C102KBRACTU

Manufacturer Part Number
C0805C102KBRACTU
Description
CAP CER 1000PF 630V X7R 0805
Manufacturer
Kemet
Series
C0805r
Datasheets

Specifications of C0805C102KBRACTU

Capacitance
1000pF
Voltage - Rated
630V
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
Filtering Switch Mode Power Supplies
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Thickness
1.25mm
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
High Voltage MLCCs
Dimensions
1.25 mm W x 2 mm L
Dissipation Factor Df
2.5
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
399-5575-2
C0805C102KBRAC
C0805C102KBRAC7800
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3VDC–250VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
Pb-Free and RoHS compliant
Code
Size
0603
0402
0805
1206
1210
1808
1825
2220
2225
EIA
1812
Metric
Code
Size
4532
4564
5650
5664
1005
1608
2012
3216
3225
4520
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
Length
L
Width
W
Thickness
T
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
Bandwidth
T
B
W
S
L
Separation
0.30 (.012)
0.70 (.028)
0.75 (.030)
B
Min.
N/A
S
C1002_X7R • 5/27/2011
Electrodes
Solder Reflow Only
Solder Reflow Only
Solder Wave or
Solder Reflow
Conductive Metalization
Technique
Mounting
100% Tin or SnPb Plate
Nickel Plate
2

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