T520D337M006ATE040 Kemet, T520D337M006ATE040 Datasheet - Page 16

• Manufacturer Part Number: T520D337M006ATE040
• Description: CAP TANT 330UF 6.3V 20% SMD
• Manufacturer: Kemet
• Series: KO Cap T520r
• Type: Moldedr

Specifications of T520D337M006ATE040

• Capacitance: 330µF
• Voltage - Rated: 6.3V
• Tolerance: ±20%
• Esr (equivalent Series Resistance): 40.0 mOhm
• Operating Temperature: -55°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 2917 (7343 Metric)
• Size / Dimension: 0.287" L x 0.169" W (7.30mm x 4.30mm)
• Height: 0.110" (2.80mm)
• Manufacturer Size Code: D
• Features: Polymer
• Capacitance Tolerance: ± 20%
• Voltage Rating: 6.3V
• Esr: 0.04ohm
• Capacitor Case Style: 2917
• Operating Temperature Range: -55°C To +105°C
• Msl: MSL 3 - 168 Hours
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Capacitor Mounting: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Other names: 399-4054-2

KEMET Organic Capacitor (KO-CAP) – T520 Series Polymer Tantalum
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Time 25°C to peak temperature
Silver Paint
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
Leadframe
(-Cathode)
temperature (t
Preheat/Soak
Polymer /Ta
s
) from T
smin
L
to T
to T
P
P
)
to T
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
)
2
O
Carbon
5
/Ta
Sn-Pb Assembly
6 minutes max
3°C/sec max
6°C/sec max
20 sec max
60-120 sec
60-150 sec
Tantalum Wire
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
Silver Adhesive
Weld
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
Washer
Leadframe
(+Anode)
T
T
25
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2015-1 • 1/10/2011
t
L
t
P
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