C1825C472JBGACTU Kemet, C1825C472JBGACTU Datasheet - Page 4
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C1825C472JBGACTU
Manufacturer Part Number
C1825C472JBGACTU
Description
CAP CER 4700PF 630V C0G 1825
Manufacturer
Kemet
Datasheet
1.C1206C101JBGACTU.pdf
(10 pages)
Specifications of C1825C472JBGACTU
Capacitance
4700pF
Voltage - Rated
630V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
General Purpose
Package / Case
1825 (4564 Metric)
Size / Dimension
0.177" L x 0.252" W (4.50mm x 6.40mm)
Thickness
1.60mm
Voltage Rating
630 Volts
Temperature Coefficient / Code
C0G (NP0)
Product
High Voltage MLCCs
Dimensions
6.4 mm W x 4.5 mm L
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Details
Other names
399-5559-2
C1825C472JBGAC
C1825C472JBGAC7800
C1825C472JBGAC
C1825C472JBGAC7800
84
Capacitance
Cap Tolerance
DF
Voltage Ratings
Operating Temperature Range
25ºC IR @ 500V
125ºC IR @ 500V
-55ºC TCC
+125ºC TCC
Dielectric Strength
Ripple Current
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Capacitance Tolerance
C = ±0.25pF*
D = ±0.5pF*
F = ±1%*
G = ±2%*
* Contact KEMET Sales for availability.
Style
C - Ceramic
Chip Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Property
J = ±5%
K = ±10%
M = ±20%
Recommended Solder Pad Dimensions
CERAMIC CHIP / HIGH VOLTAGE
C
0805
C
Capacitor Ordering Information
C0G: 1 pF to 0.010 µF
X7R: 10 pf to 0.22 µF
25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M
X7R: J, K, M
C0G: 0.1% Max
X7R: 2.5% Max
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
From -55C to +125C
100 GΩ or 1000 MΩ-µF, whichever is less
10 GΩ or 100 MΩ-µF, whichever is less
X7R: + 15%
C0G: + 30 ppm / ºC
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
Consult KEMET Sales Representative
102
Electrical Parameters
Soldering Process
pF
Packaging
Marking
K
C
Specification
R
* Contact KEMET Sales for availability.
A
G – (C0G) (±30ppm/C) (-55°C +125°C)
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
C
L = SnPb plated nickel barrier
Temperature Characteristic
Designated by Capacitance
C = 500V
B = 630V
D = 1000V
Failure Rate Level
A = Not Applicable
End Metallization
(SnPb 5% min)
C = Standard
G = 2000V
H = 3000V
F = 1500V
Z = 2500V
Voltage