C1608X5R1E224M TDK Corporation, C1608X5R1E224M Datasheet - Page 59
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C1608X5R1E224M
Manufacturer Part Number
C1608X5R1E224M
Description
CAP CER .22UF 25V X5R 0603
Manufacturer
TDK Corporation
Series
Cr
Specifications of C1608X5R1E224M
Capacitance
0.22µF
Tolerance
±20%
Package / Case
0603 (1608 Metric)
Voltage - Rated
25V
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Features
Low ESR
Applications
General Purpose
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Thickness
0.80mm
Voltage Rating
25 Volts
Operating Temperature Range
- 55 C to + 85 C
Temperature Coefficient / Code
X5R
Product
General Type MLCCs
Dimensions
0.8 mm W x 1.6 mm L
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
445-5141-2
• All specifications are subject to change without notice. Please read the precautions before using the product.
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
General
Specifications
Applied for C0603, C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Applied for C0603, C1005
Appendix - 1a
Appendix - 2a
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
c
C Series — General Application
C0603
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
c
US Catalog // C Series — General Application // Version A11
Solder Resist
100 mm
CC0201
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.3
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
0.8
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.3
0.5
1.2
2.0
2.9
3.7
5.6
c