CC0603JRNP09BN331 Yageo, CC0603JRNP09BN331 Datasheet - Page 13
![CAP CERAMIC 330PF 50V NP0 0603](/photos/10/51/105157/yageo_0603_sml.jpg)
CC0603JRNP09BN331
Manufacturer Part Number
CC0603JRNP09BN331
Description
CAP CERAMIC 330PF 50V NP0 0603
Manufacturer
Yageo
Series
CCr
Datasheet
1.CC0402JRNP09BN101.pdf
(15 pages)
Specifications of CC0603JRNP09BN331
Capacitance
330pF
Voltage - Rated
50V
Tolerance
±5%
Temperature Coefficient
C0G, NP0
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Applications
General Purpose
Package / Case
0603 (1608 Metric)
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Thickness
0.80mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
0603CG331J9B200
223886715331
311-1075-2
311-1293-2
311-1293-2
CC0603JRNP09BN331B
CC0603JRNPO9BN331
CC0603JRNPO9BN331B
223886715331
311-1075-2
311-1293-2
311-1293-2
CC0603JRNP09BN331B
CC0603JRNPO9BN331
CC0603JRNPO9BN331B
Jan 06, 2011 V6
TEST
Resistance to
soldering heat
Solderability
Rapid change
of
temperature
Surface-Mount Ceramic Multilayer Capacitors
TEST METHOD
IEC 60384-
21/22
4.9
4.10
4.11
PROCEDURE
Precondition: 150 +0/–10 °C for 1 hour, then keep for 24
±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute
Preheating: for size >1206: 100 °C to 120 °C for 1 minute
and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Preheated the temperature of 80 °C to 140 °C and
maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for lead-free containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Preconditioning;
150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
5 cycles with following detail:
30 minutes at lower category temperature
30 minutes at upper category temperature
Recovery time 24 ±2 hours
General Purpose
REQUIREMENTS
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
<General purpose series>
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF
whichever is greater
D.F. within initial specified value
R
The solder should cover over 95% of
the critical area of each termination
No visual damage
<General purpose series>
∆C/C
Class 1:
NP0: within ±1% or 1 pF
whichever is greater
D.F. meet initial specified value
R
ins
ins
within initial specified value
meet initial specified value
NP0
16 V to 50 V
Product specification
www.yageo.com
13
15