C0805C300J2GACTU Kemet, C0805C300J2GACTU Datasheet - Page 2

• Manufacturer Part Number: C0805C300J2GACTU
• Description: CAP CERM 200V NPO 0805 30PF 5%
• Manufacturer: Kemet
• Series: C0805r

Specifications of C0805C300J2GACTU

• Capacitance: 30pF
• Voltage - Rated: 200V
• Tolerance: ±5%
• Temperature Coefficient: C0G, NP0
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: General Purpose
• Package / Case: 0805 (2012 Metric)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Thickness: 0.78mm
• Voltage Rating: 200 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Temperature Coefficient / Code: C0G (NP0)
• Product: General Type MLCCs
• Dimensions: 1.25 mm W x 2 mm L
• Dissipation Factor Df: 0.1
• Lead Spacing: 0.75 mm
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: C0805C300J2GAC; C0805C300J2GAC7867; Q1608784C

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
RoHS compliant
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Code
Size
0603
0201
0402
0805
1206
1210
1808
1825
2220
2225
EIA
1812
Metric
Code
Size
0603
4532
4564
5650
5664
1005
1608
2012
3216
3225
4520
2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)
0.60 (.024) ± 0.03 (.001) 0.30 (.012) ± 0.03 (.001)
1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006)
3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)
3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)
5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)
5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)
4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008)
4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)
4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)
Length
L
Width
W
Thickness
T
0.15 (.006) ± 0.05 (.002)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.50 (0.02) ± 0.25 (.010)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.60 (.024) ± 0.35 (.014)
0.30 (.012) ± 0.10 (.004)
0.35 (.014) ± 0.15 (.006)
Bandwidth
T
B
W
S
L
Separation
0.30 (.012)
0.70 (.028)
0.75 (.030)
B
Min.
N/A
N/A
S
C1003_C0G • 5/27/2011
Electrodes
Solder Reflow Only
Solder Reflow Only
Solder Wave or
Solder Reflow
Conductive Metalization
Technique
Mounting
100% Tin or SnPb Plate
Nickel Plate
2