C1210C156K4PACTU Kemet, C1210C156K4PACTU Datasheet - Page 4
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C1210C156K4PACTU
Manufacturer Part Number
C1210C156K4PACTU
Description
CAP CER 15UF 16V X5R 1210
Manufacturer
Kemet
Datasheet
1.C1210C156K4PACTU.pdf
(8 pages)
Specifications of C1210C156K4PACTU
Capacitance
15µF
Voltage - Rated
16V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Package / Case
1210 (3225 Metric)
Size / Dimension
0.138" L x 0.102" W (3.50mm x 2.60mm)
Thickness
1.40mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
C1210C156K4PAC
C1210C156K4PAC7800
C1210C156K4PAC7800
Y
X
placement
courtyard
Grid
330mm (13.00")
178mm (7.00")
Tape & Reel Packaging
or
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Z
C
G
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Case Sizes 1210 are 12 mm tape with 8 mm pitch.
Case Sizes
Note: TU suffix represents tape and reel packaging of unmarked components.
CERAMIC CHIP CAPACITORS
TM suffix represents tape and reel packaging of marked components.
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
1210 are 8 mm tape with 4 mm pitch.
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
(.315 .012")
(.472 .012")
Packaging Information
12mm .30
8mm .30
or
available on punched paper only.
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
Anti-Static Reel
Z
0402 and 0603 case sizes
Embossed Carrier*
* Punched paper carrier used for 0402 and 0603 case size.
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
G
Reflow Solder
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
and page 87 for MIL-PRF-55681 chips.
for details on reeling quantities for commercial chips
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
X
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
g
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
(except 1825 Commercial, and 1825 & 2225 Military)
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
3.18
3.70
4.90
4.90
Z
Embossment
0.68
0.70
1.50
1.50
G
Not Recommended
Not Recommended
Wave Solder
0.80
1.10
1.40
2.00
X
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
93