mc74lvx50 ON Semiconductor, mc74lvx50 Datasheet
mc74lvx50
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mc74lvx50 Summary of contents
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... MC74LVX50 Hex Buffer The MC74LVX50 is an advanced high speed CMOS buffer fabricated with silicon gate CMOS technology. The internal circuit is composed of three stages, including a buffered output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3 ...
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... ORDERING INFORMATION Device MC74LVX50D MC74LVX50DG MC74LVX50DR2 MC74LVX50DR2G MC74LVX50DT MC74LVX50DTR2 MC74LVX50M MC74LVX50MG MC74LVX50MEL MC74LVX50MELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. MC74LVX50 Y1 Y2 ...
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... Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. The q NOTE: of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table JA and figure below. MC74LVX50 Parameter V < GND I V < ...
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... V Minimum High Level Dynamic Input Voltage IHD V Maximum Low Level Dynamic Input Voltage ILD MC74LVX50 Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î ...
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... Metric Dimensions Govern−English are in parentheses for reference only. 10 and K are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min 0.50 mm max. The component cannot rotate more than 10 within the determined cavity MC74LVX50 V CC GND t PHL INPUT Figure 5. Input Equivalent Circuit E ...
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... COMPONENT CENTER LINE 11 and K are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min 0.50 mm max. The component cannot rotate more than 10 within the determined cavity MC74LVX50 TOP TAPE SEE NOTE ...
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... MC74LVX50 1.5 mm MIN (0.06”) 20.2 mm MIN A (0.795”) FULL RADIUS Figure 7. Reel Dimensions REEL DIMENSIONS Tape Size T&R Suffix A Max 8 mm T1, T2 178 mm (7” T3, T4 330 mm (13” 330 mm (13” 360 mm (14.173” 360 mm (14.173”) DIRECTION OF FEED BARCODE LABEL Figure 8 ...
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... NO COMPONENTS TAPE 160 mm MIN Figure 10. TSSOP and SOIC R2 Reel Configuration/Orientation TAPE UTILIZATION BY PACKAGE Tape Size MC74LVX50 COMPONENTS DIRECTION OF FEED Figure 9. Tape Ends for Finished Goods User Direction of Feed SOIC TSSOP 8−Lead 8−, 14−, 16−Lead 14−, 16−Lead 20−, 24−Lead 18− ...
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... L PIN 1 IDENT. 1 0.15 (0.006 −V− C 0.10 (0.004) SEATING −T− PLANE MC74LVX50 PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE 0.25 (0.010 TSSOP−14 DT SUFFIX CASE 948G−01 ...
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... BSC H 7.40 8.20 0.291 0.323 E L 0.50 0.85 0.020 0.033 L 1.10 1.50 0.043 0.059 0.70 0.90 0.028 0.035 1 Z −−− 1.42 −−− 0.056 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC74LVX50/D ...