3666-0001 3M, 3666-0001 Datasheet - Page 27
3666-0001
Manufacturer Part Number
3666-0001
Description
CARD EDGE CONN 60POS W/O FLANGE
Manufacturer
3M
Series
3000r
Specifications of 3666-0001
Card Type
Dual Edge
Card Thickness
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Gender
Female
Number Of Positions
60
Pitch
0.100" (2.54mm)
Number Of Rows
2
Mounting Type
Free Hanging (In-Line), IDC
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Color
Gray
Product Type
Without Flanges
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
5400732558
54007325581
80-6100-9480-9
80610094809
MCE60G
MCE60G
MCE60K
54007325581
80-6100-9480-9
80610094809
MCE60G
MCE60G
MCE60K
3M.com/interconnects
Assemblies, .80 mm, Input/Output
Shrunk Delta Ribbon (SDR) Cable
Attachment (SATA) Signal Cable
Attachment (SATA) Power Cable
Serial Advanced Technology
Serial Advanced Technology
Series 1MG, 1MF, 1SF
product
Series 5601
Series 5602
3M
™
caBle aSSeMBly SolutionS
• RoHS Compliant
• Supplied as a Complete Assembly
• Supports New AIA Industrial Camera
• 11 Shielded Twisted Twinax Pairs
• Double Overall Shield with Foil and
• Straight and Right Angle
• SDR-to-SDR and MDR-to-SDR
• Mates with 3M SDR and MDR
• RoHS Compliant
• 15-Position Power Cable
• Rugged Over-Molded Construction
• “Y” Type Supports Multiple Devices
• RoHS Compliant
• 7-Position Serial Signal Assembly
• Multiple Variations in Length and
• Point-to-Point Signaling
• Polarized Interface Ensures Proper
• 26 AWG Differential Pairs
• Meets SATA 2.6 Specification
Only
Link
to C/L Frame Grabber Applications
with Four Drain Wires
Outer Braid EMI Shielded Cable
Assembly
Configurations Available
Options Available
Boardmount Products
Provided in Standard Lengths
Interface Attachments
Alignment
FeatureS
®
Standard for Mini C/L Camera
Insulation
Material: Polyvinyl Chloride
Plating
Underplating: 100 µ" [ 2.55 µm ]
Wiping Area: 30 µ" [ 0.76 µm ]
Materials Vary for Connectors,
Cables, Shells and Jackscrews.
See Website for Specifics.
Insulation
Material: High Temperature
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Solder Tails: 100 µ" [ 2.54 µm ]
Underplating: 50 µ" [ 1.27 µm ]
Insulation
Material: High Temperature
Plating
Wiping Area: 30 µ" [ 0.76 µm ]
Solder Tails: 100 µ" [ 2.54 µm ]
Underplating: 50 µ" [ 1.27 µm ]
Nickel
Minimum Gold
Thermoplastic
Gold
Tin
Nickel
Thermoplastic
Gold
Tin
Nickel
MaterialS
Current Rating: 1 A
Temperature Rating: -20°C to +85°C
Current Rating: 1 A
Temperature Rating: -20°C to +85°
Current Rating: 1 A
Temperature Rating: -20°C to +85°C
perForMance
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