3666-0001 3M, 3666-0001 Datasheet - Page 4
![CARD EDGE CONN 60POS W/O FLANGE](/photos/10/65/106579/3666-0001_sml.jpg)
3666-0001
Manufacturer Part Number
3666-0001
Description
CARD EDGE CONN 60POS W/O FLANGE
Manufacturer
3M
Series
3000r
Specifications of 3666-0001
Card Type
Dual Edge
Card Thickness
0.054" ~ 0.070" (1.37mm ~ 1.78mm)
Gender
Female
Number Of Positions
60
Pitch
0.100" (2.54mm)
Number Of Rows
2
Mounting Type
Free Hanging (In-Line), IDC
Contact Finish
Gold
Contact Finish Thickness
30µin (0.76µm)
Color
Gray
Product Type
Without Flanges
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
5400732558
54007325581
80-6100-9480-9
80610094809
MCE60G
MCE60G
MCE60K
54007325581
80-6100-9480-9
80610094809
MCE60G
MCE60G
MCE60K
4
MetPak
MetPak
product
DIN Connectors
3M
™
™
2-FB Connectors
CP2 Connectors
™
Backplane connector SolutionS
• RoHS Compliant Version Available
• DIN 41612
• C-Form Plug and Socket
• C-Form Wiremount Plugs
• R-Form Plug and Socket
• Q-Form Plug and Socket
• B-Form Wiremount Plug
• Pinless Shrouds
• Solder Tails or Press-Fit
• Inverse Versions
• EMLB Contact Loading
• PCB Retention Clips
• RoHS Compliant Version Available
• Futurebus+
• Inverse Version Available
• Vertical and Right Angle
• Stacking Versions
• Elevated Versions
• Guiding Features
• Pinless Shroud
• Power Header and Socket
• RoHS Compliant Version Available
• Compact PCI
• Types A, B, AB and C
• Header and Socket
• Grounding Options
• EMLB Contact Loading
• Coding Keys
• Pinless Shroud
and Sockets
and Socket
FeatureS
®
®
Contact
Material: Copper Alloy
Insulation
Material: Engineering Thermoplastic
Flammability UL 94V-0
Plating
Underplating: 50 µ" [ 1.27 µm ]
Interface: 30 µ" [ 0.76 µm ] Gold
Contact
Material: Copper Alloy
Insulation
Material: High Temp LCP
Flammability UL 94V-0
Plating
Underplating: 50 µ" (1.27 µm) Nickel
Interface: 10 µ" [ 0.25 µm ] or 30 µ"
Contact
Material: Copper Alloy
Insulation
Material: Glass Filled Polyester
Flammability UL 94V-0
Plating
Underplating: Nickel
Wiping Area: 30 µ" [ 0.76 µm ] Gold
7, 27 or 40 µ" [ 0.18, 0.69, 1.01 µm ] PdNi
Min. Nickel
or 3 µ" [ 0.08 µm ] Gold over
7 µ" [0.18 µm ] PdNi
[ 0.76 µm ] Gold or 3 to 5 µ"
[ 0.07 to 0.12 µm ] Gold over
MaterialS
3M.com/interconnects
perForMance
Current Rating: 3.0 A @ 30°C
Temperature Rating: -55°C to +125°C
Current Rating: Signal: 1.5 A
Temperature Rating: -55°C to +125°C
Current Rating: 1 A at +70°C
Temperature Rating: -55°C to +125°C
T-rise Above Ambient
All Contacts Simultaneously