PIC16F884-I/PT Microchip Technology, PIC16F884-I/PT Datasheet - Page 252

IC PIC MCU FLASH 4KX14 44TQFP

PIC16F884-I/PT

Manufacturer Part Number
PIC16F884-I/PT
Description
IC PIC MCU FLASH 4KX14 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F884-I/PT

Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-2
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Package
44TQFP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Quantity
Price
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PIC16F884-I/PT
0
PIC16F882/883/884/886/887
TABLE 17-2:
DS41291D-page 250
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
OS06
OS07
OS08
OS09*
OS10*
Note 1:
Param
No.
2:
3:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
T
T
HF
LF
T
ST
These parameters are characterized but not tested.
and are not tested.
Instruction cycle period (T
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
To ensure these oscillator frequency tolerances, V
device as possible. 0.1 μF and 0.01 μF values in parallel are recommended.
By design.
SC
WARM
IOSC
Sym
OSC
OSC
OSCILLATOR PARAMETERS
Internal Oscillator Switch
when running
Fail-Safe Sample Clock
Period
Internal Calibrated
HFINTOSC Frequency
Internal Uncalibrated
LFINTOSC Frequency
HFINTOSC Oscillator
Wake-up from Sleep
Start-up Time
Characteristic
(1)
-40°C ≤ T
(3)
CY
A
≤ +125°C
) equals four times the input oscillator time base period. All specified values are
(2)
Tolerance
Freq
±1%
±2%
±5%
Preliminary
DD
7.92
7.84
7.60
Min
5.5
3.5
15
3
and V
Typ†
SS
8.0
8.0
8.0
21
31
12
7
6
must be capacitively decoupled as close to the
Max
8.08
8.16
8.40
45
24
14
11
2
Units
T
MHz
MHz
MHz
kHz
ms
OSC
μs
μs
μs
© 2007 Microchip Technology Inc.
Slowest clock
LFINTOSC/64
V
0°C ≤ T
-40°C ≤ T
-40°C ≤ T
V
V
V
2.5V ≤ V
2.0V ≤ V
DD
DD
DD
DD
= 3.5V, 25°C
= 2.0V, -40°C to +85°C
= 3.0V, -40°C to +85°C
= 5.0V, -40°C to +85°C
A
Conditions
DD
DD
≤ +85°C
A
A
≤ +85°C (Ind.),
≤ +125°C (Ext.)
≤ 5.5V,
≤ 5.5V,

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