PIC16F887-I/ML Microchip Technology, PIC16F887-I/ML Datasheet - Page 14

• Manufacturer Part Number: PIC16F887-I/ML
• Description: IC PIC MCU FLASH 8KX14 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F887-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 14KB (8K x 14)
• Package / Case: 44-QFN
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: MSSP/EUSART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53273-916
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 14-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN444-1001 - DEMO BOARD FOR PICMICRO MCU
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F88X
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev. A Document (2/2007)
First revision of this document.
Added Module 1: Low-Voltage In-Circuit Serial
Programming™ (PIC16F884/883 Silicon Rev. A0);
Added Module 2: MSSP (SPI Mode).
Clarifications/Corrections to the Data Sheet - Added
Module 1: Product Identification System.
Rev. B Document (5/2007)
Clarifications/Corrections to the Data Sheet - Added
Module 2: Electrical Specification - Supply Current.
Rev. C Document (7/2007)
Added Module 3: Analog-to-Digital Converter (ADC)
Module.
Rev. D Document (8/2007)
Added Module 4: MSSP (SPI Master Mode), Module 5:
2
2
MSSP (I
C Slave Mode) and Module 6: MSSP (I
C
Master Mode).
Rev. E Document (4/2009)
Updated Errata to new format.
Data Sheet Clarification: Added Module 1: Timer1
(Block Diagram); Module 2: Comparator (C2 Block
Diagram); Module 3: ADC (Block Diagram); Module 4:
Comparator Voltage Reference; Module 5: Comparator
Voltage Reference.
Added
Module
7:
MSSP;
Added
Module
8:
Asynchronous Timer1; Added Module 9: LP/Timer1
Oscillator Operation Below 25°C; Module 10: Timer0
and WDT Prescaler Assignment Spurious Reset.
Rev. F Document (8/2009)
Added Module 11: MSSP (SPI Master Mode); Updated
Tables 2, 3, 4.
Data Sheet Clarification: Removed Modules 1, 2, 4 and
5 as the Data Sheet has already been updated
according to this version of the errata.
Added Module 2: ADC.
© 2009 Microchip Technology Inc.
DS80302F-page 14