STR710FZ2T6 STMicroelectronics, STR710FZ2T6 Datasheet - Page 12

IC MCU ARM7 TDMI 256K 144TQFP

STR710FZ2T6

Manufacturer Part Number
STR710FZ2T6
Description
IC MCU ARM7 TDMI 256K 144TQFP
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet

Specifications of STR710FZ2T6

Core Processor
ARM7
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, HDLC, I²C, SmartCard, SPI, UART/USART, USB
Peripherals
PWM, WDT
Number Of I /o
48
Program Memory Size
256KB (256K x 8 + 16K)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-TQFP, 144-VQFP
Cpu Family
STR7
Device Core
ARM7TDMI
Device Core Size
32b
Frequency (max)
66MHz
Interface Type
CAN/I2C/SPI/UART/USB
Total Internal Ram Size
64KB
# I/os (max)
48
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
4-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Processor Series
STR710x
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
64 KB
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
48
Number Of Timers
5 x 16 bit
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR7, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STR710-SK/HIT, STR711-SK/IAR, STR712-SK/IAR, STR71X-SK/RAIS, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
Minimum Operating Temperature
- 40 C
For Use With
MCBSTR7UME - MCBSTR7 + ULINK-ME DEV KITMCBSTR7 - BOARD EVAL STM STR71X SERIES497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU497-4516 - BOARD EVAL FOR STR71X SER MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
497-4511

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System architecture
12/78
Table 3.
Legend / abbreviations for
Type:
In/Output level: C = CMOS 0.3V
Port and control configuration:
Input:
Output:
10
11
12
1
2
3
4
5
6
7
8
9
P0.10
P0.3
VSS
P0.6
A.19
P0.2
VSS
A.12
V33
A.9
A.8
A.7
A
STR710 BGA ball connections
WEn.1
P2.0
P0.9
P0.7
A.15
P0.1
A.10
RDn
N.C.
N.C.
V33
A.4
B
I = input, O = output, S = supply, HiZ= high impedance,
C
T
C/T = Programmable levels: CMOS 0.3V
pu/pd= software enabled internal pull-up or pull down
pu= in reset state, the internal 100kΩ weak pull-up is enabled.
pd = in reset state, the internal 100kΩ weak pull-down is enabled.
OD = open drain (logic level)
PP = push-pull
T = true OD, (P-Buffer and protection diode to V
5 V tolerant.
T
T
= TTL 0.8 V/2 V with input trigger
= CMOS 0.3V
WEn.0
P0.11
P0.12
P1.15
P1.14
P2.1
P0.8
A.16
P0.4
A.11
A.5
A.3
C
VSS18
P0.13
P0.14
P1.13
P1.10
P0.5
A.17
A.13
P1.9
Table
VSS
V33
A.6
D
DD
DD
4:
/0.7V
/0.7V
P2.2
P2.3
P2.4
P2.5
P2.7
A.18
P0.0
VSS
V18
V33
A.2
A.1
E
DD
DD
CANRX
P1.11/
P2.6
P2.8
A.14
D.15
D.14
D.13
N.C.
N.C.
VSS
V33
A.0
with input trigger
F
USBDN
USBDP
BOOT
P2.10
P2.11
P2.14
P2.9
D.12
D.11
D.10
N.C.
V18
EN
G
CANTX
V33IO-
P1.12/
DD
P2.12
JTMS
JTCK
JTDO
P1.8
P1.7
N.C.
N.C.
VSS
PLL
D.1
H
/0.7V
JTRST
RTCX-
P2.13
DD
P1.6
N.C.
N.C.
DD
NU
D.0
D.9
D.8
D.5
CK
TO
J
n
not implemented),
or TTL 0.8 V / 2 V
RTCXTI
CKOUT
V18BK
AVSS
P2.15
TEST
P1.0
P1.5
P1.4
V33
D.7
nc
K
P
VSSIO-
VSS18
TEST
JTDI
P1.1
P1.3
N.C.
N.C.
VSS
BKP
N.C.
PLL
D.3
D.6
L
STR71xF
STDBY
RSTIN
AVDD
P0.15
DBG
RQS
P1.2
N.C.
N.C.
N.C.
N.C.
D.2
D.4
M

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