STR710FZ2T6 STMicroelectronics, STR710FZ2T6 Datasheet - Page 72

• Manufacturer Part Number: STR710FZ2T6
• Description: IC MCU ARM7 TDMI 256K 144TQFP
• Manufacturer: STMicroelectronics
• Series: STR7r

Specifications of STR710FZ2T6

• Core Processor: ARM7
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, HDLC, I²C, SmartCard, SPI, UART/USART, USB
• Peripherals: PWM, WDT
• Number Of I /o: 48
• Program Memory Size: 256KB (256K x 8 + 16K)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-TQFP, 144-VQFP
• Cpu Family: STR7
• Device Core: ARM7TDMI
• Device Core Size: 32b
• Frequency (max): 66MHz
• Interface Type: CAN/I2C/SPI/UART/USB
• Total Internal Ram Size: 64KB
• # I/os (max): 48
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Processor Series: STR710x
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 5 x 16 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR7, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR710-SK/HIT, STR711-SK/IAR, STR712-SK/IAR, STR71X-SK/RAIS, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• For Use With: MCBSTR7UME - MCBSTR7 + ULINK-ME DEV KITMCBSTR7 - BOARD EVAL STM STR71X SERIES497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU497-4516 - BOARD EVAL FOR STR71X SER MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-4511

Package characteristics
5.2
72/78
Thermal characteristics
The average chip-junction temperature, T
following equation:
Where:
●
●
●
●
P
Most of the time for the application P
may be significant if the device is configured to drive continuously external modules and/or
memories.
An approximate relationship between P
Therefore (solving equations 1 and 2):
where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
may be obtained by solving equations (1) and (2) iteratively for any value of T
Table 44.
Symbol
I/O
Θ
Θ
Θ
Θ
JA
JA
JA
JA
represents the Power Dissipation on Input and Output Pins;
T
Θ
P
P
A
D
INT
JA
is the Ambient Temperature in °C,
is the sum of P
is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
Thermal Resistance Junction-Ambient
LQFP 144 - 20 x 20 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
Thermal Resistance Junction-Ambient
LFBGA 144 - 10 x 10 x 1.7mm
is the product of I
D
Thermal characteristics
(at equilibrium) for a known T
INT
K = P
and P
DD
P
T
D
J
D
and V
= T
= K / (T
x (T
Parameter
I/O
A
A
(P
+ (P
DD
I/O
+ 273°C) + Θ
D
, expressed in Watts. This is the Chip Internal Power.
< P
J
D
= P
D
+ 273°C)
J
and T
INT
, in degrees Celsius, may be calculated using the
x Θ
INT
A.
and can be neglected. On the other hand, P
JA
Using this value of K, the values of P
+ P
J
)
(if P
I/O
JA
I/O
),
x P
is neglected) is given by:
D
2
(1)
(2)
(3)
Value
42
45
58
50
A
.
STR71xF
D
and T
°C/W
°C/W
°C/W
°C/W
Unit
I/O
J