PIC18F25J10-I/SO Microchip Technology, PIC18F25J10-I/SO Datasheet - Page 193
![IC PIC MCU FLASH 16KX16 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC18F25J10-I/SO
Manufacturer Part Number
PIC18F25J10-I/SO
Description
IC PIC MCU FLASH 16KX16 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F24J10-ISO.pdf
(368 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(6 pages)
5.PIC18F24J10-ISO.pdf
(12 pages)
6.PIC18LF24J10-ISS.pdf
(32 pages)
7.PIC18F44J10-IPT.pdf
(358 pages)
Specifications of PIC18F25J10-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPI/I2C/MSSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILAC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180011 - MODULE PLUG-IN 18F25J10 28SOICAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164331 - MODULE SKT FOR 28SSOP 18F45J10
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC18F24J10-ISO PDF datasheet #2
- PIC18F24J10-ISO PDF datasheet #3
- PIC18F24J10-ISO PDF datasheet #4
- PIC18F24J10-ISO PDF datasheet #5
- PIC18LF24J10-ISS PDF datasheet #6
- PIC18F44J10-IPT PDF datasheet #7
- Current page: 193 of 368
- Download datasheet (6Mb)
16.4.17.3
Bus collision occurs during a Stop condition if:
a)
b)
FIGURE 16-31:
FIGURE 16-32:
© 2009 Microchip Technology Inc.
After the SDAx pin has been deasserted and
allowed to float high, SDAx is sampled low after
the BRG has timed out.
After the SCLx pin is deasserted, SCLx is
sampled low before SDAx goes high.
SDAx
SCLx
PEN
BCLxIF
P
SSPxIF
SDAx
SCLx
PEN
BCLxIF
P
SSPxIF
Bus Collision During a Stop
Condition
BUS COLLISION DURING A STOP CONDITION (CASE 1)
BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDAx asserted low
Assert SDAx
T
T
BRG
BRG
T
BRG
T
BRG
PIC18F45J10 FAMILY
The Stop condition begins with SDAx asserted low.
When SDAx is sampled low, the SCLx pin is allowed to
float. When the pin is sampled high (clock arbitration),
the
SSPxADD<6:0> and counts down to 0. After the BRG
times out, SDAx is sampled. If SDAx is sampled low, a
bus collision has occurred. This is due to another
master attempting to drive a data ‘0’ (Figure 16-31). If
the SCLx pin is sampled low before SDAx is allowed to
float high, a bus collision occurs. This is another case
of another master attempting to drive a data ‘0’
(Figure 16-32).
Baud
SCLx goes low before SDAx goes high,
set BCLxIF
T
Rate
BRG
T
BRG
Generator
SDAx sampled
low after T
set BCLxIF
‘0’
‘0’
DS39682E-page 191
‘0’
‘0’
is
loaded
BRG
,
with
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