PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 11

• Manufacturer Part Number: PIC18F2431-I/SO
• Description: IC PIC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2431-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TABLE 3-3:
FIGURE 3-3:
 2010 Microchip Technology Inc.
Step 1: Direct access to config memory.
Step 2: Configure device for multi-panel writes.
Step 3: Direct access to code memory and enable erase.
Step 4: Erase single row of all panels at an offset.
Step 5: Repeat step 4, with Address Pointer incremented by 64 until all panels are erased.
Command
0000
0000
0000
0000
0000
0000
0000
0000
0000
1100
0000
0000
0000
0000
0000
0000
1111
0000
4-Bit
8E A6
8C A6
86 A6
0E 3C
6E F8
0E 00
6E F7
0E 06
6E F6
00 40
8E A6
9C A6
88 A6
6A F8
6A F7
6A F6
<DummyLSB>
<DummyMSB>
00 00
ERASE CODE MEMORY CODE SEQUENCE
Data Payload
MULTI-PANEL SINGLE ROW ERASE CODE MEMORY FLOW
Addr = Addr + 64
BSF
BSF
BSF
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 06h
MOVWF TBLPTRL
Write 40h to 3C0006h to enable multi-panel erase.
BSF
BCF
BSF
CLRF
CLRF
CLRF
Write 2 dummy bytes and start programming.
NOP - hold SCLK high for time P9.
PIC18F2331/2431/4331/4431
EECON1, EEPGD
EECON1, CFGS
EECON1, WREN
EECON1, EEPGD
EECON1, CFGS
EECON1, FREE
TBLPTRU
TBLPTRH
TBLPTRL
No
Start Erase Sequence
and hold SCLK High
Multi-Panel Erase
Delay P9 + P10
Time for Erase
Until Done
Core Instruction
Device for
Configure
to Occur
Panels
Done?
Start
Done
All
Yes
Addr = 0
DS30500B-page 11