PIC18F6621-E/PT Microchip Technology, PIC18F6621-E/PT Datasheet - Page 387
![IC PIC MCU FLASH 32KX16 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC18F6621-E/PT
Manufacturer Part Number
PIC18F6621-E/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F6525-IPT.pdf
(396 pages)
3.PIC18F6525-IPT.pdf
(8 pages)
4.PIC18F6525-IPT.pdf
(38 pages)
Specifications of PIC18F6621-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
MSSP, SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
2 x 8 bit
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F6621-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC18F6525-IPT PDF datasheet #2
- PIC18F6525-IPT PDF datasheet #3
- PIC18F6525-IPT PDF datasheet #4
- Current page: 387 of 396
- Download datasheet (8Mb)
K
Key Features
L
LFSR ................................................................................. 299
Low-Voltage Detect........................................................... 253
Low-Voltage ICSP Programming ...................................... 274
LVD. See Low-Voltage Detect.
M
Master SSP (MSSP) Module Overview ............................ 173
Master Synchronous Serial Port (MSSP). See MSSP.
Master Synchronous Serial Port. See MSSP
Memory
Memory Maps for PIC18F6X2X/8X2X
Memory Organization
Memory Programming Requirements ............................... 334
Microcontroller Mode .......................................................... 71
Microprocessor Mode ......................................................... 71
Microprocessor with Boot Block Mode ................................ 71
Migration from High-End to
Migration from Mid-Range to
MOVF................................................................................ 299
MOVFF ............................................................................. 300
MOVLB ............................................................................. 300
MOVLW ............................................................................ 301
MOVWF ............................................................................ 301
MPLAB ASM30 Assembler, Linker, Librarian ................... 318
MPLAB ICD 2 In-Circuit Debugger ................................... 319
MPLAB ICE 2000 High-Performance
MPLAB ICE 4000 High-Performance
MPLAB Integrated Development
MPLAB PM3 Device Programmer .................................... 319
MPLINK Object Linker/MPLIB Object Librarian ................ 318
MSSP ................................................................................ 173
2005 Microchip Technology Inc.
Easy Migration .............................................................. 7
Expanded Memory........................................................ 7
External Memory Interface............................................ 7
Other Special Features ................................................. 7
Characteristics .......................................................... 333
Converter Characteristics ......................................... 333
Effects of a Reset...................................................... 257
Operation .................................................................. 256
Typical Application .................................................... 253
Mode Memory Access ................................................ 40
Program Memory Modes ............................................ 41
Data Memory .............................................................. 47
Program Memory ........................................................ 39
Enhanced Devices .................................................... 379
Enhanced Devices .................................................... 378
Universal In-Circuit Emulator .................................... 319
Universal In-Circuit Emulator .................................... 319
Environment Software............................................... 317
ACK Pulse......................................................... 186, 187
Clock Stretching........................................................ 192
Clock Synchronization and the
Current Consumption........................................ 257
During Sleep ..................................................... 257
Reference Voltage Set Point ............................ 257
Modes ................................................................. 39
10-Bit Slave Receive Mode (SEN = 1).............. 192
10-Bit Slave Transmit Mode ............................. 192
7-Bit Slave Receive Mode (SEN = 1)................ 192
7-Bit Slave Transmit Mode ............................... 192
CKP bit (SEN = 1)............................................. 193
PIC18F6525/6621/8525/8621
MSSP Module
MULLW............................................................................. 302
MULWF............................................................................. 302
N
NEGF................................................................................ 303
NOP .................................................................................. 303
O
Oscillator Configuration ...................................................... 21
Oscillator Selection ........................................................... 259
Oscillator, Timer1.............................................. 135, 137, 145
Oscillator, Timer3.............................................................. 143
Oscillator, WDT................................................................. 267
Control Registers (general) ...................................... 173
Enabling SPI I/O ....................................................... 177
I
Module Operation ..................................................... 186
Operation.................................................................. 176
Slave Mode............................................................... 186
SPI Master Mode...................................................... 178
SPI Mode.................................................................. 173
SPI Slave Mode........................................................ 179
SSPBUF ................................................................... 178
SSPSR ..................................................................... 178
TMR2 Output for Clock Shift............................. 141, 142
TMR4 Output for Clock Shift..................................... 148
Typical Connection ................................................... 177
SPI Master/Slave Connection................................... 177
EC............................................................................... 21
ECIO........................................................................... 21
ECIO+PLL .................................................................. 21
ECIO+SPLL ................................................................ 21
HS............................................................................... 21
HS+PLL ...................................................................... 21
HS+SPLL.................................................................... 21
LP ............................................................................... 21
RC .............................................................................. 21
RCIO........................................................................... 21
XT ............................................................................... 21
2
C Mode .................................................................. 182
Acknowledge Sequence Timing ....................... 206
Baud Rate Generator ....................................... 199
Bus Collision
Bus Collision During a Start Condition ............. 208
Bus Collision During a Stop Condition.............. 211
Clock Arbitration ............................................... 200
Effect of a Reset ............................................... 207
I
Master Mode..................................................... 197
Multi-Master Communication, Bus
Multi-Master Mode............................................ 207
Registers .......................................................... 182
Sleep Operation ............................................... 207
Stop Condition Timing ...................................... 206
Addressing ....................................................... 186
Reception ......................................................... 187
Transmission .................................................... 187
2
C Clock Rate w/BRG ..................................... 199
During a Repeated
Reception ................................................. 203
Repeated Start Condition Timing ............. 202
Start Condition Timing.............................. 201
Transmission ............................................ 203
Collision and Arbitration ........................... 207
Start Condition.................................. 210
DS39612B-page 385
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