STR910FAW32X6 STMicroelectronics, STR910FAW32X6 Datasheet - Page 91

• Manufacturer Part Number: STR910FAW32X6
• Description: MCU 256KB FLASH 64K RAM 128LQFP
• Manufacturer: STMicroelectronics
• Series: STR9r

Specifications of STR910FAW32X6

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 96MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-LQFP
• Processor Series: STR910x
• Core: ARM966E-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN/I2C/IrDA/SSP/UART
• Maximum Clock Frequency: 96 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR9-COMSTICK, STR910-EVAL, STR91X-SK/HIT, STR91X-SK/IAR, STR91X-SK/KEI, STR91X-SK/RAI, STR9-DK/RAIS, STR91X-DK/IAR, STX-PRO/RAIS, STR912-D/RAIS, STR79-RVDK/CPP, STR79-RVDKCPP/9, STR79-RVDK, STR79-RVDK/9, STR9-RVDK/BAS, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• For Use With: 497-8268 - BOARD EVAL FOR EVAL-STR910MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES497-5067 - BOARD EVAL FOR STR910 FAMILY497-5066 - KIT STARTER KEIL FOR STR910497-5065 - KIT STARTER IAR KICKSTART STR912497-5064 - KIT STARTER FOR STR910 FAMILY497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6276

STR91xFAxxx
Table 48.
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev G. Refer to
3. Value obtained on conversions started by trigger in single mode
4. All sucessive conversions in continuous and scan modes.
Table 49.
1. Guaranteed by design, not tested in production.
2. Parameters in this table apply to devices with silicon Rev H and higher. Refer to
3. Value obtained from conversions started by trigger in single mode
4. All successive conversions in continuous and scan modes.
5. Conversion started by trigger when automatic clock gated mode enabled. Fast trigger mode is available only in devices with
6. Value obtained from conversions started by fast trigger in single mode
t
CONV(FT]
Symbol
t
t
Symbol
t
t
TR(FT)
CONV(S]
CONV(C]
CONV(S]
CONV(C]
TR(S)
TR(C)
TR(S)
TR(C)
and to
memory and to
silicon Rev H and higher.
Section 8: Device
Single mode conversion time
Single mode throughput rate
Continuous mode conversion time
Continuous mode throughput rate
Single mode conversion time
Single mode throughput rate
Continuous mode conversion time
Continuous mode throughput rate
Fast trigger mode conversion time
Fast trigger mode throughput rate
ADC conversion time (silicon Rev G)
ADC conversion time (silicon Rev H and higher)
Section 8: Device
Parameter
Parameter
marking.
marking.
(1) (2)
(1) (2)
(3)
(3)
(6)
(4)
(4)
(5)
Doc ID 13495 Rev 6
f
f
f
f
f
f
f
f
f
f
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
ADC
conditions
conditions
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
= 24 MHz
Test
Test
Table 5
2*16/f
1*16/f
for device rev identification in OTP memory
1.33
0.66
Min
Min
100
Table 5
ADC
ADC
for device rev identification in OTP
1*16/f
1*16/f
1*16/f
Value
Value
1500
1500
0.66
0.66
0.66
Typ
Typ
Electrical characteristics
ADC
ADC
ADC
3*16/f
2*16/f
1200
Max
Max
1.33
500
750
2
ADC
ADC
ksps
ksps
ksps
ksps
ksps
Unit
Unit
91/102
µs
µs
µs
µs
µs
µs
µs
µs