C8051F334-GMR Silicon Laboratories Inc, C8051F334-GMR Datasheet - Page 37

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C8051F334-GMR

Manufacturer Part Number
C8051F334-GMR
Description
IC 8051 MCU 2K FLASH 20MLP
Manufacturer
Silicon Laboratories Inc
Series
C8051F33xr
Datasheets

Specifications of C8051F334-GMR

Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
17
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-QFN
For Use With
336-1451 - ADAPTER PROGRAM TOOLSTICK F330
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F334-GMR
Manufacturer:
ZILLTEK
Quantity:
3 340
Part Number:
C8051F334-GMR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95 mm openings on a 1.1 mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (71% Paste Coverage).
Body Components.
Figure 4.3. QFN-20 Recommended PCB Land Pattern
Table 4.3. QFN-20 PCB Land Pattern Dimesions
0.20
Min
3.70
3.70
0.50
Max
0.30
Rev. 1.7
Dimension
X2
Y1
Y2
C8051F330/1/2/3/4/5
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25
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