MCIMX353CJQ5C Freescale Semiconductor, MCIMX353CJQ5C Datasheet - Page 49

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MCIMX353CJQ5C

Manufacturer Part Number
MCIMX353CJQ5C
Description
MULTIMEDIA PROCESSOR 400-MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX35r
Datasheet

Specifications of MCIMX353CJQ5C

Core Processor
ARM11
Core Size
32-Bit
Speed
532MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-MAPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

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1
Freescale Semiconductor
SD10 and SD11 are determined by SDRAM controller register settings.
SD10
SD11
SD7
ID
SDCLK
CAS
CKE
ADDR
RAS
WE
CS
Address hold time
Precharge cycle period
Auto precharge command period
SDR SDRAM CLK parameters are measured from the 50% point—that is,
“high” is defined as 50% of signal value and “low” is defined as 50% of
signal value.
The timing parameters are similar to the ones used in SDRAM data sheets.
Table 35
the ESDCTL at the negative edge of SDCLK, and the parameters are
measured at maximum memory frequency.
i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 9
Don’t care
BA
Table 35. SDRAM Refresh Timing Parameters (continued)
indicates SDRAM requirements. All output signals are driven by
Figure 30. SDRAM Self-Refresh Cycle Timing Diagram
1
Parameter
SD16
1
NOTE
Symbol
tAH
tRP
tRC
SD16
Min.
1.8
1
2
Max.
20
4
clock
clock
Unit
ns
49

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