PIC18F8620T-E/PT Microchip Technology, PIC18F8620T-E/PT Datasheet - Page 18
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PIC18F8620T-E/PT
Manufacturer Part Number
PIC18F8620T-E/PT
Description
IC PIC MCU FLASH 32KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F8520T-IPT.pdf
(380 pages)
3.PIC18F8520T-IPT.pdf
(40 pages)
4.PIC18F6620-IPT.pdf
(14 pages)
5.PIC18F6620-IPT.pdf
(12 pages)
Specifications of PIC18F8620T-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.75K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3840 B
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
68
Number Of Timers
2 x 8 bit
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183022, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit
Data Rom Size
1024 B
Height
1 mm
Length
12 mm
Supply Voltage (max)
5.5 V, 5.8 V
Supply Voltage (min)
3.9 V, 4.2 V
Width
12 mm
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F8620T-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC18FXX20
3.4
The ID Locations are programmed much like the code
memory, except that multi-panel writes must be
disabled.
automatically be enabled, based on the value of the
Table Pointer. The ID registers are mapped in
addresses 200000h through 200007h. These locations
read out normally, even after code protection.
Figure 3-6 demonstrates the code sequence required
to write the ID locations.
TABLE 3-6:
In order to modify the ID locations, refer to the
methodology described in Section 3.2.2, “Modifying
Code Memory”. As with code memory, the ID locations
must be erased before modified.
DS39583C-page 18
Step 1: Direct access to config memory.
Step 2: Configure device for single panel writes.
Step 3: Direct access to code memory.
Step 4: Load write buffer. Panel will be automatically determined by address.
Note:
Command
0000
0000
0000
0000
0000
0000
0000
0000
1100
0000
0000
0000
0000
0000
0000
0000
0000
1101
1101
1101
1111
0000
4-Bit
ID Location Programming
Even though multi-panel writes are dis-
abled, the user must still fill the 8-byte data
buffer for the panel.
The single panel that will be written will
8E A6
8C A6
0E 3C
6E F8
0E 00
6E F7
0E 06
6E F6
00 00
8E A6
9C A6
0E 20
6E F8
0E 00
6E F7
0E 00
6E F6
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
<LSB><MSB>
00 00
WRITE ID SEQUENCE
Data Payload
BSF
BSF
MOVLW 3Ch
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 06h
MOVWF TBLPTRL
Write 00h to 3C0006h to enable single panel writes.
BSF
BCF
MOVLW 20h
MOVWF TBLPTRU
MOVLW 00h
MOVWF TBLPTRH
MOVLW 00h
MOVWF TBLPTRL
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and post-increment address by 2
Write 2 bytes and start programming
NOP - hold SCLK high for time P9
EECON1, EEPGD
EECON1, CFGS
EECON1, EEPGD
EECON1, CFGS
Core Instruction
2010 Microchip Technology Inc.