MCP607-I/SN Microchip Technology, MCP607-I/SN Datasheet - Page 37

• Manufacturer Part Number: MCP607-I/SN
• Description: IC OPAMP 2.5V DUAL R-R 8SOIC
• Manufacturer: Microchip Technology

Specifications of MCP607-I/SN

• Slew Rate: 0.08 V/µs
• Package / Case: 8-SOIC (3.9mm Width)
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 155kHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 250µV
• Current - Supply: 18.7µA
• Current - Output / Channel: 17mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Channels: 2
• Common Mode Rejection Ratio (min): 75 dB
• Input Offset Voltage: 0.25 mV
• Input Bias Current (max): 1 pA
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Shutdown: No
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2.5 V
• Technology: CMOS
• Voltage Gain Db: 121 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision F (September 2009)
The following is the list of modifications:
1.
2.
3.
Revision E (March 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Revision D (February 2005)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Revision C (January 2001)
• Undocumented changes
Revision B (May 2000)
• Undocumented changes
Revision A (January 2000)
• Original Release of this Document.
© 2009 Microchip Technology Inc.
Corrected RL text in
“Typical Performance Curves”.
Corrected
(Section 3.0 “Pin Descriptions”).
Updated Section 6.0 “Packaging Informa-
tion”. Updated package outline drawings.
Increased maximum operating V
Added test circuits.
Updated performance curves.
Added
Added
Section 4.1.2 “Input Voltage and Current
Limits”, ad Section 4.1.3 “Normal Opera-
tion”.
Updated Section 5.0 “Design Aids”
Updated Section 6.0 “Packaging Informa-
tion”. Updated package outline drawings.
Added Section 3.0 “Pin Descriptions”.
Updated Section 4.0 “Applications Information”.
Added Section 4.3 “Capacitive Loads”
Updated Section 5.0 “Design Aids” to include
FilterLab
macro model.
Corrected and updated Section 6.0 “Packaging
Information”.
Added Appendix A: “Revision History”.
Figure
®
Section 4.1.1
and to point to the latest SPICE
devices’
2-31.
REVISION HISTORY
Figure 2-22
pins
“Phase
DD
in
in Section 2.0
.
Reversal”,
Table 3-1
MCP606/7/8/9
DS11177F-page 37