HFA1112IB Intersil, HFA1112IB Datasheet - Page 2

• Manufacturer Part Number: HFA1112IB
• Description: IC BUFFER 850MHZ 8-SOIC
• Manufacturer: Intersil

Specifications of HFA1112IB

• Amplifier Type: Buffer
• Number Of Circuits: 1
• Slew Rate: 2400 V/µs
• -3db Bandwidth: 850MHz
• Current - Input Bias: 25µA
• Voltage - Input Offset: 8000µV
• Current - Supply: 21mA
• Current - Output / Channel: 60mA
• Voltage - Supply, Single/dual (±): 9 V ~ 11 V, ±4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Gain Bandwidth Product: -

Absolute Maximum Ratings
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
INPUT CHARACTERISTICS
Output Offset Voltage
Output Offset Voltage Drift
PSRR
Input Noise Voltage (Note 3)
Non-Inverting Input Noise Current (Note 3)
Non-Inverting Input Bias Current
Non-Inverting Input Resistance
Inverting Input Resistance (Note 2)
Input Capacitance
Input Common Mode Range
TRANSFER CHARACTERISTICS
Gain
Gain
DC Non-Linearity (Note 3)
OUTPUT CHARACTERISTICS
Output Voltage (Note 3)
Output Current (Note 3)
Closed Loop Output Impedance
POWER SUPPLY CHARACTERISTICS
Supply Voltage Range
Supply Current (Note 3)
AC CHARACTERISTICS
-3dB Bandwidth
(V
1. θ
OUT
JA
= 0.2V
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
P-P
PARAMETER
, Notes 2, 3)
2
V
SUPPLY
= ±5V, A
100kHz
100kHz
A
A
A
A
R
DC, A
A
A
A
V
V
V
V
V
V
V
L
= +1, V
= +2, V
= +2, ±2V Full Scale
= -1
= 50Ω
= -1
= +1
= +2
TEST CONDITIONS
V
V
= +2
= +1, R
IN
IN
o
C to 85
= +2V
= +1V
SUPPLY
L
= 100Ω, Unless Otherwise Specified
o
HFA1112
C
TEMP (
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
25, 85
PDIP Package . . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
-40
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
o
C)
0.980
0.975
MIN
±2.5
1.96
1.95
±3.0
±2.5
±4.5
240
450
500
350
39
35
25
50
35
-
-
-
-
-
-
-
-
-
-
-
-
0.990
TYP
±2.8
1.98
0.02
±3.3
±3.0
300
800
850
550
0.3
10
45
37
25
50
60
50
21
8
9
2
-
-
-
-
-
-
-
1.025
θ
MAX
1.02
2.04
2.05
±5.5
360
JA
25
35
40
65
26
33
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
170
125
(
o
C/W) θ
o
nV/√Hz
pA/√Hz
UNITS
C to 150
µV/
JC
MHz
MHz
MHz
V/V
V/V
V/V
V/V
mV
mV
mA
mA
mA
mA
µA
µA
kΩ
dB
dB
pF
%
Ω
V
V
V
Ω
V
N/A
N/A
o
(
o
C
C/W)
o
o
o
C
C
C