AD8040AR Analog Devices Inc, AD8040AR Datasheet - Page 19

• Manufacturer Part Number: AD8040AR
• Description: IC AMP GP R-R QUAD LP 14SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD8040AR

• Rohs Status: RoHS non-compliant
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 63 V/µs
• -3db Bandwidth: 125MHz
• Current - Input Bias: 1.7µA
• Voltage - Input Offset: 2000µV
• Current - Supply: 1.4mA
• Current - Output / Channel: 170mA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 12 V, ±1.35 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Gain Bandwidth Product: -

OUTLINE DIMENSIONS
Figure 56. 8-Lead Standard Small Outline Package, Narrow Body [SOIC] (R-8)
0.15 MAX
0.10 MAX
1.60 BSC
1.30
1.15
0.90
1.00
0.90
0.70
1.25 BSC
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
PIN 1
Figure 58. 8-Lead Small Outline Transistor Package [SOT23] (RJ-8)
4.00 (0.1574)
3.80 (0.1497)
Figure 57. 6-Lead Plastic Surface-Mount Package [SC70] (KS-6)
1.30 BSC
0.10
PIN 1
0.10 COPLANARITY
1
8
COMPLIANT TO JEDEC STANDARDS MS-012AA
Dimensions shown in millimeters and (inches)
0.38
0.22
6
COMPLIANT TO JEDEC STANDARDS MO-203AB
COMPLIANT TO JEDEC STANDARDS MO-178BA
1
2.90 BSC
2.00 BSC
7
SEATING
2
BSC
1.95
5.00 (0.1968)
4.80 (0.1890)
0.30
0.15
1.27 (0.0500)
8
1
PLANE
5
2
Dimensions shown in millimeters
Dimensions shown in millimeters
6
3
BSC
4
3
5
4
0.65 BSC
5
4
0.51 (0.0201)
0.31 (0.0122)
0.65 BSC
6.20 (0.2440)
5.80 (0.2284)
1.45 MAX
SEATING
PLANE
2.10 BSC
SEATING
PLANE
2.80 BSC
1.10 MAX
1.75 (0.0688)
1.35 (0.0532)
0.25 (0.0098)
0.17 (0.0067)
0.22
0.08
0.22
0.08
8°
4°
0°
8°
0°
8°
4°
0°
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
× 45°
0.46
0.36
0.26
Rev. A | Page 19 of 20
0.60
0.45
0.30
COPLANARITY
0.25 (0.0098)
0.10 (0.0039)
1.05
1.00
0.80
4.00 (0.1575)
3.80 (0.1496)
Figure 60. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14)
4.50
4.40
4.30
PIN 1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.10
Figure 59. 14-Lead Standard Small Outline Package [SOIC] (R-14)
0.15
0.05
14
1
BSC
0.65
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Dimensions shown in millimeters and (inches)
14
1
COMPLIANT TO JEDEC STANDARDS MS-012AB
1.27 (0.0500)
0.30
0.19
5.10
5.00
4.90
8.75 (0.3445)
8.55 (0.3366)
BSC
0.51 (0.0201)
0.31 (0.0122)
Dimensions shown in millimeters
8
7
SEATING
PLANE
8
7
BSC
6.40
AD8029/AD8030/AD8040
1.20
MAX
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
1.75 (0.0689)
1.35 (0.0531)
COPLANARITY
0.20
0.09
0.10
0.25 (0.0098)
0.17 (0.0067)
8°
0°
8°
0°




0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
× 45°

0.75
0.60
0.45