MCF5328CVM240 Freescale Semiconductor, MCF5328CVM240 Datasheet - Page 15

• Manufacturer Part Number: MCF5328CVM240
• Description: IC MCU 32BIT 240MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF532xr

Specifications of MCF5328CVM240

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, PWM, WDT
• Number Of I /o: 94
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Program Memory Size: 16KB
• Cpu Speed: 240MHz
• Embedded Interface Type: CAN, I2C, MAC, Ethernet, QSPI, UART
• Rohs Compliant: Yes
• Family Name: MPC5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 240MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

4.3
The pinout for the MCF5327CVM240 package is shown below.
C
D
G
H
M
N
5
This document contains electrical specification tables and reference timing diagrams for the MCF5329 microcontroller unit.
This section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing
specifications of MCF5329.
The electrical specifications are preliminary and are from previous designs or design simulations. These specifications may not
be fully tested or guaranteed at this early stage of the product life cycle. However, for production silicon, these specifications
will be met. Finalized specifications will be published after complete characterization and device qualifications have been
completed.
Freescale Semiconductor
A
B
E
F
J
K
L
P
SD_CKE SD_CS0 I2C_SCL I2C_SDA
SD_RAS
FB_CLK SD_A10
SD_WE
DT1IN
D2TIN
DT3IN
BWE1
D12
D29
D25
D24
D20
D18
BE/
1
1
SD_CLK
Pinout—196 MAPBGA
Electrical Characteristics
DT0IN
LCD_
LCD_
D13
D30
D26
D22
D19
D17
D4
D0
TS
D8
2
2
SD_CAS
SD_CLK
BWE2
LCD_
LCD_
LCD_
LCD_
D14
D31
D27
D21
D16
BE/
D5
D6
D2
D1
D9
3
3
Figure 5. MCF5327CVM240 Pinout Top View (196 MAPBGA)
SD_DR_
BWE3
BWE0
LCD_
LCD_
LCD_
LCD_
DQS
D15
D10
D28
D23
BE/
BE/
D9
D8
D7
D3
D6
D5
4
4
MCF532x ColdFire
SD_VDD SD_VDD SD_VDD
EVDD
LCD_
LCD_
LCD_
LCD_
DQS3
IVDD
IVDD
D13
D12
D11
D10
D11
SD_
D7
D4
D3
D2
5
5
EVDD
EVDD
DQS2
LCD_
LCD_
LCD_
LCD_
VSS
VSS
D17
D16
D15
D14
SD_
R/W
OE
D1
D0
6
6
LCD_FLM/
LCD_CON
®
SD_VDD
PSTCLK
ACD/OE
DDATA3
DDATA2
VSYNC
TRAST
RCON
EVDD
EVDD
TCLK/
LCD_
LCD_
Microprocessor Data Sheet, Rev. 5
VSS
VSS
CLS
7
7
LCD_LP/
SD_VDD SD_VDD
SD_VDD SD_VDD
DDATA1
DDATA0
HSYNC
LSCLK
EVDD
EVDD
LCD_
LCD_
LCD_
PST3
PST2
REV
VSS
VSS
PS
8
8
SPL_SPR
U1TXD
U1CTS
U1RTS
EVDD
EVDD
EVDD
LCD_
PST1
PST0
TDO/
DSO
VSS
VSS
9
9
OTG_VDD
SD_VDD
FB_CS0
FB_CS1
FB_CS2
U1RXD
QSPI_
QSPI_
QSPI_
QSPI_
DOUT
TEST
IVDD
IVDD
PLL_
USB
VDD
CLK
CS2
DIN
10
10
FB_CS3
RESET
U0RXD
EXTAL
DRAM
QSPI_
EVDD
PLL_
XTAL
VSS
CS1
A23
A22
A19
SEL
32K
32K
A8
A4
11
11
USBHOST
HOST_P
TDI/DSI
OTG_M
U0RTS
U0TXD
Electrical Characteristics
JTAG_
BKPT
_VSS
TMS/
USB
USB
A20
A21
A18
A11
EN
A7
A3
12
12
HOST_M
OTG_P
U0CTS
IRQ7
IRQ4
IRQ2
IRQ1
USB
USB
A16
A17
A13
A10
A6
A2
TA
13
13
RSTOUT
DSCLK
PWM3
PWM1
EXTAL
TRST/
XTAL
IRQ3
A15
A14
A12
A9
A5
A1
A0
14
14
15
C
D
G
H
M
N
A
B
E
F
K
L
P
J