MCF5328CVM240 Freescale Semiconductor, MCF5328CVM240 Datasheet - Page 45

• Manufacturer Part Number: MCF5328CVM240
• Description: IC MCU 32BIT 240MHZ 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF532xr

Specifications of MCF5328CVM240

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 240MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, PWM, WDT
• Number Of I /o: 94
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Program Memory Size: 16KB
• Cpu Speed: 240MHz
• Embedded Interface Type: CAN, I2C, MAC, Ethernet, QSPI, UART
• Rohs Compliant: Yes
• Family Name: MPC5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 240MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

7
This section contains drawings showing the pinout and the packaging and mechanical characteristics of the MCF532x devices.
7.1
Figure 36
Freescale Semiconductor
15X
e
shows MCF5328CVM240, MCF53281CVM240, and MCF5329CVM240 package dimensions.
Y
E
Package Information
Package Dimensions—256 MAPBGA
S
X
0.20
16
The mechanical drawings are the latest revisions at the time of publication of this
document. The most up-to-date mechanical drawings can be found at the product summary
page located at http://www.freescale.com/coldfire.
15
14
Laser mark for pin A1
identification in
this area
Bottom View
13
12
Top View
View M-M
11
10
D
7
6
5
MCF532x ColdFire
15X
S
4
3
e
2
Figure 36. 256 MAPBGA Package Outline
1
C
D
G
H
M
N
R
A
B
E
F
J
K
L
P
T
Metalized mark for
pin A1 identification
in this area
K
256X
M
M
0.25
0.10
®
b
Microprocessor Data Sheet, Rev. 5
3
M
M
NOTE
Z
Z
X
Y
A
A2
A1
Notes:
Z
Rotated 90° Clockwise
1.
2.
3.
4.
5.
4
Detail K
Dimensions are in millimeters.
Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
Datum Z (seating plane) is defined by
the spherical crowns of the solder
balls.
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
Dim
A1
A2
A
D
E
S
b
e
1.25
0.27
0.40
Millimeters
Min
256X
17.00 BSC
17.00 BSC
1.00 BSC
0.50 BSC
1.16 REF
0.15
Max
1.60
0.47
0.60
Z
Package Information
0.30
5
Z
45