RMPA2265 Fairchild Semiconductor, RMPA2265 Datasheet
RMPA2265
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RMPA2265 Summary of contents
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... Fairchild Semiconductor Corporation RMPA2265 Rev. I General Description The RMPA2265 power amplifier module (PAM) is designed for WCDMA/HSDPA applications in both the 1850–1910 and 1920– 1980 MHz bands. The 2 stage PAM is internally matched to 50 Ohms to minimize the use of external components and features a low-power mode to reduce standby current and DC power consumption during peak phone usage. High power-added effi ...
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... Spurious Outputs Ruggedness with Load 3 Mismatch Tc Case Operating Temperature DC Characteristics Iccq Quiescent Current Iref Reference Current Icc(off) Shutdown Leakage Current Notes: 1. All parameters met noted. 2. All phase angles. 3. Guaranteed by design. RMPA2265 Rev. I Parameter 1 Min Typ Max 1920 1980 440 120 -40 -42 ...
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... CC1 CC2 V Reference Voltage ref Operating Shutdown V Bias Control Voltage mode Low-Power High-Power P Linear Output Power (low-power) OUT 1920–1980 MHz (high power) 1850–1910 MHz (high power) T Case Operating Temperature C RMPA2265 Rev Min Typ Max 1850 1910 27 420 120 -40 -42 -54 -66 2 ...
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... RMPA2265 3x3 WCDMA PA , Freq=1.95GHz 45.0 44.0 43.0 42.0 41.0 40.0 39.0 38.0 37.0 36.0 35.0 27.0 27.6 27.8 28.0 RMPA2265 3x3 WCDMA PA , Freq=1.95GHz -50.0 -51.0 -52.0 -53.0 -54.0 -55.0 -56.0 -57.0 -58.0 -59.0 -60.0 27.0 27.6 27.8 28.0 4 RMPA2265 3x3 WCDMA PA ...
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... DC Turn On Sequence: 1. Vcc1 = Vcc2 = 3.4V (typical) 2. Vref = 2.85V (typical) 3. High-Power: Vmode = 0V (Pout > 16dBm) Low-Power: Vmode = 2.0V (Pout < 16dBm) RMPA2265 Rev. I RMPA2265 3x3 WCDMA PA at US-PCS Freq Vcc=3.4V, Vref=2.85V, Vmode=0V, Pout=27.5dBm 45.0 44.0 43.0 42.0 41.0 40.0 39 ...
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... A/R 8 SN63 A/R 9 SN96 Evaluation Board Schematic 3.3 µF VCC1 VMODE 1000 pF RMPA2265 Rev. I Part Number Description PC Board SMA Connector Terminals Assembly, RMPA2265 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3µF Capacitor (1206) 0.1µF Capacitor (0603) 0.1µF Capacitor (0603) ...
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... Signal Description Pin # Signal Name 1 Vcc1 Vmode 4 5 GND 6 GND 7 RF Out 8 Vcc2 9 GND RMPA2265 Rev. I TOP VIEW FRONT VIEW 5 6 2.60mm 1.00mm 0.20mm BOTTOM VIEW Supply Voltage to Input Stage RF Input Signal High Power/Low Power Switch Vref Reference Voltage Ground ...
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... RMPA2265 Rev. I Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. Reflow Profile • Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A typical heating rate is 1-2° ...
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... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete RMPA2265 Rev. I POP™ IntelliMAX™ ISOPLANAR™ Power247™ LittleFET™ PowerEdge™ MICROCOUPLER™ PowerSaver™ PowerTrench MicroFET™ ...