RMPA2265 Fairchild Semiconductor, RMPA2265 Datasheet - Page 8

• Manufacturer Part Number: RMPA2265
• Description: IC MOD RF POWER AMP 8PIN 3X3LCC
• Manufacturer: Fairchild Semiconductor

Specifications of RMPA2265

• Current - Supply: 45mA
• Frequency: 1.92GHz ~ 1.98GHz
• Gain: 28dB
• Noise Figure: 4dB
• Package / Case: 8-LCC
• Rf Type: W-CDMA
• Voltage - Supply: 3V ~ 4.2V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• P1db: -
• Test Frequency: -
• Other names: RMPA2265TR

RMPA2265 Rev. I
Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Precautions to Avoid Permanent Device Damage:
• Cleanliness: Observe proper handling procedures to ensure
• Device Cleaning: Standard board cleaning techniques should
• Static Sensitivity: Follow ESD precautions to protect against
• General Handling: Handle the package on the top with a
• Device Storage: Devices are supplied in heat-sealed,
Device Usage:
Fairchild recommends the following procedures prior to
assembly.
• Dry-bake devices at 125°C for 24 hours minimum. Note: The
• Assemble the dry-baked devices within 7 days of removal
• During the 7-day period, the devices must be stored in an
• If the 7-day period or the environmental conditions have been
Recommended Solder Reflow Profile
clean devices and PCBs. Devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC and ground contact
areas.
not present device problems provided that the boards are
properly dried to remove solvents or water residues.
ESD damage:
– A properly grounded static-dissipative surface on which to
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each person
vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, and ground
contacts on the package bottom. Do not apply excessive
pressure to the top of the lid.
moisture-barrier bags. In this condition, devices are protected
and require no special storage conditions. Once the sealed
bag has been opened, devices should be stored in a dry
nitrogen environment.
shipping trays cannot withstand 125°C baking temperature.
from the oven.
environment of less than 60% relative humidity and a
maximum temperature of 30°C
exceeded, then the dry-bake procedure must be repeated.
place devices.
to wear while handling devices.
DEG (°C)
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1°C/SEC
183°C
60
120
SOAK AT 150°C
FOR 60 SEC
8
TIME (SEC)
Solder Materials & Temperature Profile:
Reflow soldering is the preferred method of SMT attachment.
Hand soldering is not recommended.
Reflow Profile
• Ramp-up: During this stage the solvents are evaporated from
• Pre-heat/soak: The soak temperature stage serves two
• Reflow Zone: If the temperature is too high, then devices may
• Cooling Zone: Steep thermal gradients may give rise to
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-free
attachment of the heat sink to the PWB. The solder joint should
be 95% void-free and be a consistent thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow of the
solder with a heat gun. The device should not be subjected to
more than 225°C and reflow solder in the molten state for more
than 5 seconds. No more than 2 rework operations should be
performed.
the solder paste. Care should be taken to prevent rapid
oxidation (or paste slump) and solder bursts caused by violent
solvent out-gassing. A typical heating rate is 1-2°C/sec.
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 120–150 seconds at 150°C.
be damaged by mechanical stress due to thermal mismatch or
there may be problems due to excessive solder oxidation.
Excessive time at temperature can enhance the formation of
inter-metallic compounds at the lead/board interface and may
lead to early mechanical failure of the joint. Reflow must occur
prior to the flux being completely driven off. The duration of
peak reflow temperature should not exceed 10 seconds.
Maximum soldering temperatures should be in the range 215–
220°C, with a maximum limit of 225°C.
excessive thermal shock. However, rapid cooling promotes a
finer grain structure and a more crack-resistant solder joint.
The illustration below indicates the recommended soldering
profile.
180
45 SEC (MAX)
ABOVE 183°C
240
10 SEC
1°C/SEC
300
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