APTM100H18FG Microsemi Power Products Group, APTM100H18FG Datasheet

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APTM100H18FG

Manufacturer Part Number
APTM100H18FG
Description
MOSFET MOD FULL BRIDGE 1000V SP6
Manufacturer
Microsemi Power Products Group
Datasheet

Specifications of APTM100H18FG

Fet Type
4 N-Channel (H-Bridge)
Fet Feature
Standard
Rds On (max) @ Id, Vgs
210 mOhm @ 21.5A, 10V
Drain To Source Voltage (vdss)
1000V (1kV)
Current - Continuous Drain (id) @ 25° C
43A
Vgs(th) (max) @ Id
5V @ 5mA
Gate Charge (qg) @ Vgs
372nC @ 10V
Input Capacitance (ciss) @ Vds
10400pF @ 25V
Power - Max
780W
Mounting Type
Chassis Mount
Package / Case
SP6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Absolute maximum ratings
Symbol
R
V
MOSFET Power Module
V
E
E
I
I
P
DSon
I
DM
AR
G1
S1
G2
S2
DSS
AR
AS
D
GS
D
G1
S1
S3
G3
Drain - Source Breakdown Voltage
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
VBUS
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Full - Bridge
Q1
Q2
0/VBUS
VB US
0/VBUS
Parameter
OUT1
OUT2
Q3
Q4
www.microsemi.com
G3
S3
G4
S4
G2
S2
S4
G4
Application
Features
Benefits
V
R
I
D
T
T
T
DSS
DSon
c
c
c
= 25°C
= 80°C
= 25°C
= 43A @ Tc = 25°C
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Power MOS 7
Kelvin source for easy drive
Very low stray inductance
High level of integration
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
-
-
-
-
-
-
-
-
= 1000V
= 180mΩ typ @ Tj = 25°C
Low R
Low input and Miller capacitance
Low gate charge
Fast intrinsic reverse diode
Avalanche energy rated
Very rugged
Symmetrical design
M5 power connectors
Max ratings
APTM100H18FG
DSon
1000
3000
172
±30
210
780
43
33
25
50
®
FREDFETs
Unit
mΩ
mJ
W
V
A
V
A
1 – 6

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APTM100H18FG Summary of contents

Page 1

... Avalanche current (repetitive and non repetitive Repetitive Avalanche Energy AR E Single Pulse Avalanche Energy AS These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com APTM100H18FG V = 1000V DSS R = 180mΩ typ @ Tj = 25°C DSon I = 43A @ Tc = 25°C D Application • ...

Page 2

... 43A 125° 670V 25°C di /dt = 200A/µ 125°C j ≤ V ≤ 150° DSS j www.microsemi.com APTM100H18FG Min Typ Max Unit 200 = 25°C µA 1000 = 125°C 180 210 mΩ ±150 nA Min Typ Max Unit 10.4 nF 1.76 0.32 372 ...

Page 3

... J T Storage Temperature Range STG T Operating Case Temperature C Torque Mounting torque Wt Package Weight SP6 Package outline (dimensions in mm) See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com APTM100H18FG To heatsink M6 For terminals M5 www.microsemi.com Min Typ Max Unit 0.16 °C/W 2500 V ...

Page 4

... Pulse Duration (Seconds) 160 V 7V 140 250µs pulse test @ < 0.5 duty cycle 120 6.5V 100 5. Drain Current vs Case Temperature =20V 100 120 25 www.microsemi.com APTM100H18FG 0 Transfert Characteristics > I (on)xR (on)MAX =25° =125°C T =-55° Gate to Source Voltage ( 100 125 150 T , Case Temperature (° ...

Page 5

... T , Case Temperature (°C) C Capacitance vs Drain to Source Voltage 100000 Ciss 10000 Coss 1000 Crss 100 Drain to Source Voltage (V) DS www.microsemi.com APTM100H18FG ON resistance vs Temperature 2.5 V =10V GS I =21.5A D 2.0 1.5 1.0 0.5 0.0 -50 - Junction Temperature (°C) J Maximum Safe Operating Area ...

Page 6

... Switching Energy vs Gate Resistance L=100µH E off Source to Drain Diode Forward Voltage 1000 100 10 1 0.2 0.4 0.6 0 www.microsemi.com APTM100H18FG Rise and Fall times vs Current =670V t =2.5Ω f =125° Drain Current ( =670V off =43A =125° off Gate Resistance (Ohms) T =150° =25° ...

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