NTD5862NT4G ON Semiconductor, NTD5862NT4G Datasheet

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NTD5862NT4G

Manufacturer Part Number
NTD5862NT4G
Description
NFET 60V 102A 6MOHM DPAK-3
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD5862NT4G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
5.7 mOhm @ 45A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
90A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
82nC @ 10V
Input Capacitance (ciss) @ Vds
6000pF @ 25V
Power - Max
96W
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD5862NT4G
Manufacturer:
ON Semiconductor
Quantity:
73
Part Number:
NTD5862NT4G
Manufacturer:
ON
Quantity:
12 500
NTD5862N
N-Channel Power MOSFET
60 V, 90 A, 5.7 mW
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Limited by package to 50 A continuous.
2. Surface−mounted on FR4 board using 1 in sq pad size
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2010
August, 2010 − Rev. 0
THERMAL RESISTANCE MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Gate−to−Source Voltage
Continuous Drain Cur-
rent (R
Power Dissipation
(R
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (L = 0.3 mH)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
− Non−Repetitive (t
Junction−to−Case (Drain)
Junction−to−Ambient − Steady State (Note 2)
Low R
High Current Capability
100% Avalanche Tested
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
(Cu area = 1.127 in sq [2 oz] including traces.
qJC
)
qJC
DS(on)
) (Note 1)
Parameter
Parameter
p
< 10 ms)
(T
Steady
State
J
= 25°C unless otherwise noted)
t
p
= 10 ms
T
T
T
C
C
C
= 100°C
= 25°C
= 25°C
Symbol
Symbol
T
V
R
R
V
V
J
E
I
P
, T
DSS
DM
T
qJC
I
I
qJA
GS
GS
D
AS
S
D
L
stg
Value
−55 to
Value
"20
"30
1.3
335
150
205
260
37
60
90
57
96
90
1
°C/W
Unit
Unit
mJ
°C
°C
W
V
V
V
A
A
A
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
V
(BR)DSS
60 V
(Surface Mount)
CASE 369C
Gate
1 2
STYLE 2
1
ORDERING INFORMATION
DPAK
G
Y
WW
5862N = Device Code
G
Drain
Drain 3
MARKING DIAGRAMS
3
& PIN ASSIGNMENT
N−CHANNEL MOSFET
4
2
http://onsemi.com
Source
5.7 mW @ 10 V
R
4
= Year
= Work Week
= Pb−Free Package
DS(on)
D
Publication Order Number:
MAX
S
(Straight Lead)
Gate
CASE 369D
1
STYLE 2
1
DPAK
2
Drain
Drain
3
4
NTD5862N/D
2
I
D
90 A
3
Source
4
MAX

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NTD5862NT4G Summary of contents

Page 1

NTD5862N N-Channel Power MOSFET 5.7 mW Features • Low R DS(on) • High Current Capability • 100% Avalanche Tested • These Devices are Pb−Free, Halogen Free and are RoHS Compliant MAXIMUM RATINGS (T = 25°C unless ...

Page 2

... Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Order Number NTD5862N−1G NTD5862NT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/ 25°C unless otherwise noted) ...

Page 3

T = 25° 160 120 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.030 0.025 0.020 0.015 0.010 0.005 0.000 ...

Page 4

C iss 5000 4000 3000 2000 C 1000 oss C rss DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 ...

Page 5

Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.000001 0.00001 0.0001 TYPICAL CHARACTERISTICS 0.001 0.01 t, PULSE TIME (s) Figure 13. Thermal Response http://onsemi.com 5 0 ...

Page 6

... DETAIL 0.005 (0.13 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE GAUGE SEATING L2 C PLANE PLANE DETAIL A ROTATED SOLDERING FOOTPRINT* 6.20 3 ...

Page 7

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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