XC3S200AN-4FT256I Xilinx Inc, XC3S200AN-4FT256I Datasheet - Page 23

• Manufacturer Part Number: XC3S200AN-4FT256I
• Description: IC FPGA SPARTAN 3AN 256FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3ANr

Specifications of XC3S200AN-4FT256I

• Number Of Logic Elements/cells: 4032
• Number Of Labs/clbs: 448
• Total Ram Bits: 294912
• Number Of I /o: 195
• Number Of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Device DNA Read Endurance
Table 17: Device DNA Identifier Memory Characteristics
In-System Flash Memory Data Retention, Program/Write Endurance
Table 18: In-System Flash (ISF) Memory Characteristics
DS557 (v4.1) April 1, 2011
Product Specification
Notes:
1.
ISF_PAGE_REWRITE
ISF_PAGE_CYCLES
ISF_SPR_CYCLES
ISF_SEC_CYCLES
ISF_RETENTION
DNA_CYCLES
Minimum value at which functionality is still guaranteed. Do not exceed these values.
ISF_ACTIVE
Symbol
Symbol
Number of READ operations or JTAG ISC_DNA read operations. Unaffected by
HOLD or SHIFT operations
Data retention
Time that the ISF memory is selected and active. SPI_ACCESS design primitive
pins CSB = Low, CLK toggling
Number of program/erase cycles, per ISF memory page
Number of cumulative random (non-sequential) page erase/program operations
within a sector before pages must be rewritten
Number of program/erase cycles for Sector Protection Register
Number of program cycles for Sector Lockdown Register per sector,
user-programmable field in Security Register, and Power-of-2 Page Size
Description
Description
www.xilinx.com
Spartan-3AN FPGA Family: DC and Switching Characteristics
Minimum
30,000,000
Minimum
100,000
10,000
10,000
20
2
1
(1)
Cycles
Cycles
Cycles
cycles
Units
Units
Years
Years
Cycle
Read
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