EQW030A0F1Z Lineage Power, EQW030A0F1Z Datasheet - Page 19

• Manufacturer Part Number: EQW030A0F1Z
• Description: DC/DC Converters & Regulators 48Vin 3.3Vout 30A TH
• Manufacturer: Lineage Power
• Type: Step Downr
• Series: EQW030r

Specifications of EQW030A0F1Z

• Output Power: 99 W
• Input Voltage Range: 36 V to 75 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 3.3 V
• Output Current (channel 1): 30 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 3.3 V
• Package / Case: DIP
• Output Current: 30A
• Input Voltage: 48V
• Screening Level: Industrial
• Product Length (mm): 22.9mm
• Product Height (mm): 8.5mm
• Product Depth (mm): 57.9mm
• Mounting Style: Through Hole
• Pin Count: 8
• Product: Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: CC109114063

Data Sheet
September 21, 2010
Surface Mount Information
Figure 65. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The surface mountable modules in the EQW family
use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 66 shows the new CP
connector before and after reflow soldering onto the
end-board assembly.
Figure 66. Column Pin Connector Before and After
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn
Sn/Ag
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
LINEAGE
3.8
o
C (Sn/Pb solder) or 217-218
/Cu
Reflow Soldering.
POWER
63
0.7
/Pb
(SAC) solder for –Z codes. The CP
37
) solder for non-Z codes, or
Solder Ball
Insulator
EQW Board
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current
End assembly PCB
o
C (SAC solder),
(continued)
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 67 and 68. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 67. Recommended Reflow Profile for
Tin/Lead (Sn/Pb) process.
Figure 68. Time Limit, T
Tin/Lead (Sn/Pb) process.
300
200
250
240
235
230
225
220
205
200
215
210
100
150
50
0
0
EQW010-040 Series Power Modules
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
lim
-1
, Curve Above 205
30
o
C
40
T
205
lim
o
above
C
Co o ling
zo ne
1 -4
50
o
Cs
o
-1
C for
19
60