EQW030A0F1Z Lineage Power, EQW030A0F1Z Datasheet - Page 20

• Manufacturer Part Number: EQW030A0F1Z
• Description: DC/DC Converters & Regulators 48Vin 3.3Vout 30A TH
• Manufacturer: Lineage Power
• Type: Step Downr
• Series: EQW030r

Specifications of EQW030A0F1Z

• Output Power: 99 W
• Input Voltage Range: 36 V to 75 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 3.3 V
• Output Current (channel 1): 30 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 3.3 V
• Package / Case: DIP
• Output Current: 30A
• Input Voltage: 48V
• Screening Level: Industrial
• Product Length (mm): 22.9mm
• Product Height (mm): 8.5mm
• Product Depth (mm): 57.9mm
• Mounting Style: Through Hole
• Pin Count: 8
• Product: Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: CC109114063

Data Sheet
September 21, 2010
Surface Mount Information
Lead Free Soldering
The –Z version of the EQW010-040 modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 69.
LINEAGE
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
POWER
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
36 – 75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current
15 Seconds
60 Seconds
(continued)
Cooling
Zone
Figure 69. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EQW010-040 modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of  30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
EQW010-040 Series Power Modules
20