PKU4513PI Ericsson Power Modules, PKU4513PI Datasheet - Page 36

• Manufacturer Part Number: PKU4513PI
• Description: DC/DC Converters & Regulators 12Vdc 4.2A Isolated Input 36-75V 50W
• Manufacturer: Ericsson Power Modules
• Series: PKUr

Specifications of PKU4513PI

• Output Power: 50 W
• Input Voltage Range: 36 V to 75 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 12 V
• Output Current (channel 1): 4.2 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: Sixteenth Brick
• Output Type: Isolated
• Product: Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Soldering Information - Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb or Pb-free processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 8 chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
of the solder melting temperature, (T
for more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of solder
paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be used,
if the products are kept in a controlled environment (dry pack
handling and storage) prior to assembly.
General reflow process specifications
Average ramp-up (T
Typical solder melting (liquidus)
temperature
Minimum reflow time above T
Minimum pin temperature
Peak product temperature
Average ramp-down (T
Maximum time 25°C to peak
Prepared (also subject responsible if other)
MICJAN
Approved
MPM/BK/E [Magnus Broman]
PKU 4000 Series
DC/DC converters, Input 36-75 V, Output 25 A/50 W
Temperature
T
L
T
PIN
minimum
PRODUCT
PRODUCT
Time in preheat
)
T
/ soak zone
PRODUCT
Time 25°C to peak
)
L
T
T
T
maximum
L
PIN
PRODUCT
SnPb eutectic
3°C/s max
183°C
30 s
210°C
225°C
6°C/s max
6 minutes
L
, 183°C for Sn63Pb37)
Time in
reflow
Checked
See §1
PIN
Pb-free
3°C/s max
221°C
30 s
235°C
260°C
6°C/s max
8 minutes
profile
) in excess
Pin
Product
profile
Time
PRODUCT SPECIFICATION
MECHANICAL.
No.
5/1301-BMR 602 Uen
Date
2007-12-17
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
excess of the solder melting temperature (T
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
Dry Pack Information
Surface mounted versions of the products are delivered in
standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment
and no longer can be considered dry, the modules must be
baked according to J-STD-033.
Thermocoupler Attachment
PRODUCT
) since this will likely be the warmest part of the
Pin 2 for measurement of maximum peak product
reflow temperature, T
PRODUCT
PRODUCT
Technical Specifi cation
EN/LZT 146 308 R4B July 2008
© Ericsson Power Modules AB
Rev
C
Pin 8 for measurement of minimum
solder joint temperature, T
must not exceed 225 °C at any time.
must not exceed 260 °C at any time.
P
Reference
PIN
L
, 217 to 221°C for
PIN
) in
1 (4)
36