W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 66

• Manufacturer Part Number: W25Q64CVSSIG
• Description: IC SPI FLASH 64MBIT 8-SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q64CVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 80MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.083", 2.10mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5822008

13.1 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
13. PACKAGE SPECIFICATION
SYMBOL
A1
A2
D1
E1
D
H
A
b
C
E
e
L
y
θ
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
0°
-
MILLIMETERS
1.27 BSC
NOM
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
-
-
0.010
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
8°
- 66 -
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
MIN
0°
-
0.050 BSC
INCHES
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
-
-
0.004
MAX
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
8°
W25Q64CV