W25Q64CVSSIG Winbond Electronics, W25Q64CVSSIG Datasheet - Page 72

• Manufacturer Part Number: W25Q64CVSSIG
• Description: IC SPI FLASH 64MBIT 8-SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q64CVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (8M x 8)
• Speed: 80MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.083", 2.10mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5822008

14. ORDERING INFORMATION
Notes:
1a. Only the 2
1b. The “W” prefix is not included on the part marking.
2a. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape
2b. For shipments with OTP feature enabled, please specify when placing orders.
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
64C = 64M-bit
V = 2.7V to 3.6V
SS = 8-pin SOIC 208-mil
SF = 16-pin SOIC 300-mil
G =
P
I = Industrial (-40°C to +85°C)
=
T) or Tray (shape S), when placing orders.
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb
Green Package with Status Register Power-Down & OTP enabled
nd
letter is used for the part marking; WSON package type ZP and ZE are not used for the part marking.
(2)
ZP = 8-pad WSON 6x5mm
ZE = 8-pad WSON 8x6mm
(1)
- 72 -
W 25Q xx V xx
DA = 8-pin PDIP 300-mil
W25Q64CV
2
O
(1)
3
)